A kind of preparation method of crystalline silicon solar cell
A technology of solar cells and crystalline silicon, applied in the field of solar energy, can solve the problems of increasing the cost of solar modules, limited selection of inverters, adverse effects on system efficiency, etc. Simple and easy method
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Embodiment 1
[0029] A method for preparing a crystalline silicon solar cell, taking the preparation of an existing conventional cell as an example, comprises the following steps:
[0030] (1) Texturing, diffusion, and edge etching of the silicon wafer;
[0031] (2) Form a silicon dioxide dielectric film on the light-receiving surface of the silicon wafer by PECVD, and the silicon oxide thickness is 2.2nm;
[0032] (3) Plating anti-reflection film, printing electrodes by screen printing, and sintering to form ohmic contact;
[0033] (4) Using conventional packaging materials, the battery strings are interconnected, packaged, and laminated to make components.
Embodiment 2
[0035] A method for preparing a crystalline silicon solar cell, taking the preparation of an existing conventional cell as an example, comprises the following steps:
[0036] (1) Texturing, diffusion, and edge etching of the silicon wafer;
[0037] (2) Form a silicon dioxide dielectric film on both sides of the silicon wafer by PECVD, and the silicon dioxide thickness is 2.2nm;
[0038] (3) Plating anti-reflection film, printing electrodes by screen printing, and sintering to form ohmic contact;
[0039] (4) Using battery sheets with the same efficiency level as in Example 1 and conventional packaging materials, the battery strings are interconnected, packaged, and laminated to make components.
Embodiment 3
[0050] A method for preparing a crystalline silicon solar cell, taking the preparation of a MWT cell as an example, comprises the following steps:
[0051] (1) Texturing, diffusion, and edge etching of the silicon wafer;
[0052] (2) Form a silicon dioxide dielectric film on the light-receiving surface of the silicon wafer by PECVD, and the silicon oxide thickness is 2.5nm;
[0053] (3) Plating anti-reflection film, drilling, printing electrodes by screen printing, and sintering to form ohmic contact;
[0054] (4) Using conventional packaging materials, the battery strings are interconnected, packaged, and laminated to make components.
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