Plating solution for nickel-cubic boron nitride film through electroplating method and preparation method thereof

A technology of cubic boron nitride and electroplating method, which is applied in the direction of electrolytic coating, coating, etc., can solve the problems of low content of cubic boron nitride and uneven distribution of cubic boron nitride particles, and achieve the effect of uniform distribution and firm mosaic

Inactive Publication Date: 2013-07-17
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low cubic boron nitride content and uneven distribution of cubic boron nitride particles in the nickel-cubic boron nitride film prepared by the existing method, the invention provides an electroplating method for preparing nickel-cubic boron nitride film Plating solution and preparation method thereof, using the plating solution for electroplating, can effectively improve the content of cubic boron nitride in the nickel-cubic boron nitride film, not only improve the distribution of cubic boron nitride particles in the film, but also improve the The bond strength between film and substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The electroplating method prepares the plating solution that nickel-cubic boron nitride thin film is used, is made by dissolving boric acid, ammonium chloride, nickel sulfamate and sodium lauryl sulfate in deionized water, contains boric acid 30g in every liter of plating solution, Ammonium chloride 5g, nickel sulfamate 280g, sodium lauryl sulfate 0.6g.

[0018] Its preparation method is:

[0019] 1) Weigh 30g of boric acid, 5g of ammonium chloride, 280g of nickel sulfamate and 0.6g of sodium lauryl sulfate, and dissolve the weighed substances in appropriate amount of deionized water to prepare a solution for later use;

[0020] 2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0021] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepare the plating solution....

Embodiment 2

[0024] The electroplating method prepares the plating solution that nickel-cubic boron nitride thin film is used, is made by dissolving boric acid, ammonium chloride, nickel sulfamate and sodium lauryl sulfate in deionized water, contains boric acid 50g in every liter of plating solution, Ammonium chloride 15g, nickel sulfamate 320g, sodium lauryl sulfate 1.0g.

[0025] Its preparation method is:

[0026] 1) Weigh 50g of boric acid, 15g of ammonium chloride, 320g of nickel sulfamate and 1.0g of sodium lauryl sulfate, and dissolve the weighed substances in appropriate amount of deionized water to prepare a solution for later use;

[0027] 2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0028] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepare the plating solutio...

Embodiment 3

[0031] Electroplating method prepares the plating solution that nickel-cubic boron nitride thin film is used, is made by dissolving boric acid, ammonium chloride, nickel sulfamate and sodium lauryl sulfate in deionized water, contains boric acid 40g in every liter of plating solution, Ammonium chloride 10g, nickel sulfamate 300g, sodium lauryl sulfate 0.8g.

[0032] Its preparation method is:

[0033] 1) Weigh 40g of boric acid, 10g of ammonium chloride, 300g of nickel sulfamate and 0.8g of sodium lauryl sulfate, respectively, and dissolve each of the weighed substances in an appropriate amount of deionized water to prepare a solution for later use;

[0034] 2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0035] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepar...

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Abstract

The invention discloses a plating solution for a nickel-cubic boron nitride film through an electroplating method and a preparation method thereof. The plating solution is prepared through dissolving baric acid, ammonium chloride, nickel aminosulfonate and sodium lauryl sulfate in deionized water, and each liter of the plating solution contains 30-50 g of the baric acid, 5-15 g of the ammonium chloride, 280-320 g of the nickel aminosulfonate and 0.6-1.0 g of the sodium lauryl sulfate. A formula of the plating solution is optimized, so that the nickel-cubic boron nitride powder in the plating layer of the nickel-cubic boron nitride film produced by the electroplating method is uniformly distributed, and no agglomeration is generated; and moreover, a nickel layer of the film is relatively smooth, and the nickel-cubic boron nitride powder in the film does not generate the agglomeration and is firmly embedded.

Description

technical field [0001] The invention relates to the field of preparation of nickel-cubic boron nitride thin films, in particular to a plating solution for preparing nickel-cubic boron nitride thin films by an electroplating method and a preparation method thereof. Background technique [0002] Cubic boron nitride (cBN) is a new type of semiconductor material with excellent physical and chemical properties, such as high hardness, high thermal conductivity, wide band gap, high thermal stability and chemical stability, suitable for use as iron-based alloy tool coating . [0003] The typical physical vapor deposition methods for preparing cubic boron nitride thin films mainly include sputtering, ion plating and pulsed laser deposition, and the main chemical methods include radio frequency glow discharge plasma CVD, hot wire assisted radio frequency glow discharge plasma CVD, electron cyclotron resonance CVD, etc. Scientific researchers have used various physical vapor depositi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D3/12
Inventor 祝要民刘雅琴姚怀刘伟苌清华
Owner HENAN UNIV OF SCI & TECH
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