Manufacturing method of PN node of P-type pseudo-single crystal silicon solar cell
A manufacturing method and technology of quasi-single crystal silicon, applied in the direction of final product manufacturing, sustainable manufacturing/processing, circuits, etc. Performance and conversion efficiency and other issues, to achieve the effect of reducing the difference in battery square resistance and improving electrical performance and conversion efficiency
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Embodiment 1
[0038] Put a set of P-type quasi-monocrystalline silicon wafers after texturing and cleaning into the diffusion furnace. In this embodiment, a set of P-type quasi-monocrystalline silicon wafers is specifically 25 pieces, which are carried by a quartz boat. Quasi-monocrystalline silicon wafers are processed as follows:
[0039] Adjust the temperature in the diffusion furnace to 750°C (that is, the first temperature), and pretreat the P-type quasi-monocrystalline silicon wafers at a pressure of -50pa (first pressure). The processing time is preferably 5-10 minutes ;
[0040] Then increase the temperature to increase the temperature in the diffusion furnace to 800°C (the second temperature), and carry phosphorus oxychloride into the diffusion furnace by nitrogen at a pressure of -50pa, maintaining the flow rate of phosphorus oxychloride at 1L / min, the duration is 10 minutes;
[0041] Then lower the temperature, stop the introduction of phosphorus oxychloride, keep the temperature in ...
Embodiment 2
[0053] Put a set of P-type quasi-monocrystalline silicon wafers after texturing and cleaning into the diffusion furnace. In this embodiment, a set of P-type quasi-monocrystalline silicon wafers is specifically 25 pieces, which are carried by a quartz boat. Quasi-monocrystalline silicon wafers are processed as follows:
[0054] Adjust the temperature in the diffusion furnace to 750°C (ie the first temperature), and pretreat the P-type quasi-single crystal silicon wafers at a pressure of -100pa (first pressure). The processing time is preferably 5-10 minutes ;
[0055] Then increase the temperature to increase the temperature in the diffusion furnace to 750°C (the second temperature), and carry phosphorus oxychloride into the diffusion furnace by nitrogen at a pressure of -100 pa, keeping the flow rate of phosphorus oxychloride at 0.5 L / min, duration is 15 minutes;
[0056] Then lower the temperature, stop the introduction of phosphorus oxychloride, keep the temperature in the diffus...
Embodiment 3
[0068] Put a set of P-type quasi-monocrystalline silicon wafers after texturing and cleaning into the diffusion furnace. In this embodiment, a set of P-type quasi-monocrystalline silicon wafers is specifically 25 pieces, which are carried by a quartz boat. Quasi-monocrystalline silicon wafers are processed as follows:
[0069] Adjust the temperature in the diffusion furnace to 725°C (that is, the first temperature), and pretreat the P-type quasi-single crystal silicon wafers under a pressure of -75pa (first pressure). The processing time is preferably 5-10 minutes ;
[0070] Then increase the temperature to increase the temperature in the diffusion furnace to 775°C (the second temperature), and carry phosphorus oxychloride into the diffusion furnace by nitrogen at a pressure of -75pa, keeping the flow rate of phosphorus oxychloride at 0.75 L / min, duration is 12 minutes;
[0071] Then lower the temperature, stop the introduction of phosphorus oxychloride, keep the temperature in the...
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