Copper alloy for electronic devices, method for producing copper alloy for electronic devices, and copper alloy rolled material for electronic devices

Abstract

A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. A method of producing a copper alloy includes: performing heating of a copper material to a temperature of not lower than 500° C. and not higher than 1000° C.; performing quenching to cool the heated copper material to 200° C. or lower with a cooling rate of 200° C. / min or more; and performing working of the cooled copper material, wherein the copper material is composed of a copper alloy containing Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less.

Description

technical field [0001] The present invention relates to a copper alloy for electronic equipment suitable for electrical and electronic components such as terminals, connectors, and relays, a method for producing a copper alloy for electronic equipment, and a rolled copper alloy material for electronic equipment. [0002] This application claims priority based on Japanese Patent Application No. 2010-270890 for which it applied on December 3, 2010, The content is used for this specification. Background technique [0003] Conventionally, along with miniaturization of electronic equipment, electric equipment, etc., electrical and electronic components such as terminals, connectors, and relays used in these electronic equipment, electrical equipment, and the like have been required to be miniaturized and thinned. Therefore, copper alloys excellent in elasticity, strength, and electrical conductivity are required as materials constituting electrical and electronic components. In ...

AI Technical Summary

Problems solved by technology

[0011] In addition, the Cu-Mg-P alloy described in Patent Document 3 has high electrical conductivity but insufficient mechanical properties such as yield strength and tensile strength.

And, since the tensile modulus of elasticity is high, there is a problem that it is not suitable for connectors, etc.

Images