Copper alloy for electronic devices, method for producing copper alloy for electronic devices, and copper alloy rolled material for electronic devices

A technology for electronic equipment and manufacturing methods, applied in the direction of conductive materials, conductive materials, metal/alloy conductors, etc., can solve the problems of unsuitable connectors, insufficient mechanical properties such as yield strength and tensile strength, and high tensile modulus of elasticity, etc. problems, to achieve high yield strength, low tensile modulus of elasticity, high electrical conductivity

Active Publication Date: 2013-07-31
MITSUBISHI MATERIALS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] In addition, the Cu-Mg-P alloy described in Patent Document 3 has high electrical conductivity but insufficient mechanical properties such as yield strength and tensile strength.
And, since the tensile modulus of elasticity is high, there is a problem that it is not suitable for connectors, etc.

Method used

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  • Copper alloy for electronic devices, method for producing copper alloy for electronic devices, and copper alloy rolled material for electronic devices
  • Copper alloy for electronic devices, method for producing copper alloy for electronic devices, and copper alloy rolled material for electronic devices
  • Copper alloy for electronic devices, method for producing copper alloy for electronic devices, and copper alloy rolled material for electronic devices

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Experimental program
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Embodiment

[0125] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the present invention will be described.

[0126] A copper raw material composed of oxygen-free copper (ASTM B152C10100) with a purity of 99.99% by mass or higher was prepared. The copper raw material was put into a high-purity graphite crucible, and subjected to high-frequency melting in an atmosphere furnace with an Ar gas atmosphere to obtain molten copper metal. In the obtained molten copper metal, various additive elements were added to prepare the composition shown in Tables 1 and 2, and a copper alloy molten metal was obtained. Ingots are produced by pouring molten copper alloy metal into carbon molds. In addition, the size of the ingot was about 20 mm in thickness×about 20 mm in width×about 100 to 120 mm in length. In addition, the remainder of the component compositions shown in Tables 1 and 2 are copper and unavoidable impurities.

[0127] As a homogenization treatment,...

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PUM

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Abstract

A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. A method of producing a copper alloy includes: performing heating of a copper material to a temperature of not lower than 500° C. and not higher than 1000° C.; performing quenching to cool the heated copper material to 200° C. or lower with a cooling rate of 200° C. / min or more; and performing working of the cooled copper material, wherein the copper material is composed of a copper alloy containing Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less.

Description

technical field [0001] The present invention relates to a copper alloy for electronic equipment suitable for electrical and electronic components such as terminals, connectors, and relays, a method for producing a copper alloy for electronic equipment, and a rolled copper alloy material for electronic equipment. [0002] This application claims priority based on Japanese Patent Application No. 2010-270890 for which it applied on December 3, 2010, The content is used for this specification. Background technique [0003] Conventionally, along with miniaturization of electronic equipment, electric equipment, etc., electrical and electronic components such as terminals, connectors, and relays used in these electronic equipment, electrical equipment, and the like have been required to be miniaturized and thinned. Therefore, copper alloys excellent in elasticity, strength, and electrical conductivity are required as materials constituting electrical and electronic components. In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/01C22C9/02C22C9/04C22C9/06C22F1/08H01B1/02C22F1/00C22F1/02
CPCH01B1/026H01B13/0016C22C9/01C22F1/08
Inventor 牧一诚伊藤优树
Owner MITSUBISHI MATERIALS CORP
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