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Encapsulating and testing method of quantum effect photoelectric detection array and reading circuit

A photoelectric detection and readout circuit technology, which is applied in the direction of circuits, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problems that affect the accuracy of packaging and testing, easily damaged devices and circuits, and the cumbersome testing process. Achieve shorter signal and power/ground paths, facilitate testing, reduce package failure and manufacturing cost

Active Publication Date: 2013-08-21
EAST CHINA NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The packaging and testing of the new quantum effect compound semiconductor photodetection array in the prior art adopts the welding method, and the input and output terminals of the new device, the readout circuit and the test device are connected and welded, but each connection welding is very easy to break For devices and circuits, soldering will also introduce parasitic parameters such as resistance, capacitance, and inductance. The packaging noise is large, and the signal delay affects the accuracy of packaging testing. Moreover, the testing process is very cumbersome, and it is easy to cause misuse to cause damage to the device due to static electricity.

Method used

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  • Encapsulating and testing method of quantum effect photoelectric detection array and reading circuit
  • Encapsulating and testing method of quantum effect photoelectric detection array and reading circuit
  • Encapsulating and testing method of quantum effect photoelectric detection array and reading circuit

Examples

Experimental program
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Effect test

Embodiment 1

[0019] The present invention takes the readout circuit test as an example to further elaborate the present invention, and the specific operation process is as follows:

[0020] (1) Tube socket packaging

[0021] Press-weld the silicon-based readout integrated circuit on the PCB substrate, and then package the substrate in a tube socket with a probe and a light-transmitting cover plate. When packaging, the side with the circuit is facing down, so that it is convenient for later docking Paste the device.

[0022] (2) Adapter design

[0023] See attached figure 1 ~ attached figure 2 , the adapter 7 is an airtight device that is fixedly connected to the base 2 and the cavity 1, the base 2 is provided with a test base 10, and the two sides of the test base 10 are provided with two rows of pins corresponding to the socket probes Seat 8, cavity 1 is provided with light-transmitting window 6, two lead-out line interfaces 5, cooling nozzle 4 and exhaust valve 3, and two lead-out l...

Embodiment 2

[0029] The present invention takes the docking test of the photoelectric detection array device and the readout circuit as an example to further elaborate the present invention, and the specific operation process is as follows:

[0030] (1) Tube socket package

[0031] On the basis of the successful test of the above-mentioned readout circuit, take out the tube holder, and then seal and pressure-weld the photodetector array on the PCB substrate, that is, paste the photodetector array device facing upwards, so that the light beam can directly hit the device window.

[0032] (2) Adapter design

[0033] See attached figure 1 ~ attached figure 2 , the adapter 7 is an airtight device that is fixedly connected to the base 2 and the cavity 1, the base 2 is provided with a test base 10, and the two sides of the test base 10 are provided with two rows of pins corresponding to the socket probes Seat 8, cavity 1 is provided with light-transmitting window 6, two lead-out line interfac...

Embodiment 3

[0039] The present invention takes the test of the photoelectric detection array device as an example to further elaborate the present invention, and the specific operation procedure is as follows:

[0040] (1) Tube socket package

[0041] The photoelectric detection array device is press-welded on the silicon substrate, and then the substrate is packaged in a tube seat provided with a probe and a transparent cover plate.

[0042] (2) Adapter design

[0043] See attached figure 1 ~ attached figure 2 , the adapter 7 is an airtight device that is fixedly connected to the base 2 and the cavity 1, the base 2 is provided with a test base 10, and the two sides of the test base 10 are provided with two rows of pins corresponding to the socket probes Seat 8, cavity 1 is provided with light-transmitting window 6, two lead-out line interfaces 5, cooling nozzle 4 and exhaust valve 3, and two lead-out line interfaces 5 are electrically connected with two rows of pin sockets 8 by lead ...

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Abstract

The invention discloses an encapsulating and testing method of a quantum effect photoelectric detection array and a reading circuit. The encapsulating and testing method of the quantum effect photoelectric detection array and the reading circuit is characterized in that the reading circuit, the photoelectric detection array or a photoelectric detection array connected with the reading circuit in an abutted mode are encapsulated in tube seats, and then the tube seats are arranged in an adapter connected with a timing sequence testing plate and an oscilloscope. A controlling and testing light path carries out performance tests on the devices in the tube seats. The adapter is a sealing device for fixed connection between a base and a cavity. Compared with the prior art, the encapsulating and testing method of the quantum effect photoelectric detection array and the reading circuit can conveniently carry out the tests, procedures of wiring and welding are removed in the whole testing process, faulted operation is effectively prevented, damage to the devices by static is reduced. Failed encapsulation is reduced and the encapsulating and testing method facilitates wide application of a novel photoelectric detector.

Description

technical field [0001] The invention relates to the technical field of circuit design and optoelectronic integration, in particular to a test method for a quantum effect photoelectric detection array and a readout circuit. Background technique [0002] At present, photoelectric detectors have been widely used in meteorology, astronomy, earth observation, night vision, navigation, aircraft control, early warning systems and other commercial, industrial and military fields, especially in the needs of a large number of civilian spectrometers such as food safety, environment and biological monitoring. is growing. In addition to silicon photodetectors, CCDs, and CMOS image sensors, quantum-effect compound optoelectronic devices have emerged due to their high sensitivity and precise and controllable device structure. The detection wavelengths range from ultraviolet to infrared, very long-wave, and even terahertz. It has attracted attention and will gradually enter the market. Amo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/98
Inventor 郭方敏刘晓艳
Owner EAST CHINA NORMAL UNIV