Flame-retardant dielectric substrate material for printed circuit and preparation method of flame-retardant dielectric substrate material

A technology for dielectric substrates and printed circuits, applied in the field of functional materials, can solve the problems of limited application fields, decreased application performance of rigid copper clad laminates, easy cracking of the substrate, etc., and achieves excellent flame retardant performance and processing performance, environment-friendly, economical far-reaching effect

Active Publication Date: 2013-09-04
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For rigid copper-clad laminates added with ordinary flame retardants, even if they are very thin, the substrate is easily broken when bent by external force
Therefore,

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] Example 1

[0025] Adjust the roller temperature of the plastic mill to 180℃, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM rubber masterbatch into the mill to mix Mix uniformly (about 60min); adjust the roller distance of the mill to 3mm, add 1g dendritic organic montmorillonite to mix evenly (about 20min); adjust the roller distance to 1mm, continue mixing until the rubber compound The surface is smooth and no gap (about 10min); adjust the roll distance of the mill to 3mm, add 5 grams of hyperbranched polyphosphate to make it evenly mixed (about 20min); adjust the roll distance to 1mm, the rubber roll presses out the sheet , Pressurize on a flat vulcanizing machine at 220°C and 12MPa pressure for 10 minutes, and then pressurize at room temperature and 12MPa pressure for 20 minutes to obtain the flame-retardant dielectric substrate material.

[0026] The test data of tensile strength, elongation...

Example Embodiment

[0027] Example 2

[0028] Adjust the roller temperature of the plastic mill to 200℃, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM rubber masterbatch into the mill to mix Mix evenly (about 50min); adjust the roller pitch of the mill to 4mm, add 3 grams of dendritic organic montmorillonite to mix evenly (about 25min); adjust the roller pitch to 1.5mm and continue mixing until the rubber The surface of the material is smooth and no gap (about 15min); adjust the roll distance of the mill to 4mm, add 8g of hyperbranched polyphosphate to make it evenly mixed (about 25min); adjust the roll distance to 1.5mm, and the rubber material is rolled The film is discharged and pressed on a flat vulcanizer at 210°C and 13 MPa pressure for 15 minutes, and then at room temperature and 11 MPa pressure for 25 minutes to obtain the flame-retardant dielectric substrate material.

[0029] The test data of tensile strength, el...

Example Embodiment

[0030] Example 3

[0031] Adjust the roller temperature of the plastic mill to 220℃, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM rubber masterbatch into the mill to mix Mix uniformly (about 40min); adjust the roller distance of the mill to 5mm, add 5 grams of dendritic organic montmorillonite to mix evenly (about 30min); adjust the roller distance to 12mm, continue mixing until the rubber compound The surface is smooth and no gaps (about 20min); adjust the roll distance of the mill to 5mm, add 10 grams of hyperbranched polyphosphate to make it evenly mixed (about 30min); adjust the roll distance to 2mm, the rubber roll press , On a flat vulcanizer at 200 DEG C and 15 MPa pressure for 20 minutes, and then at room temperature and 10 MPa pressure for 30 minutes to obtain the flame-retardant dielectric substrate material.

[0032] The test data of tensile strength, elongation at break and limiting oxygen ...

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PUM

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Abstract

The invention discloses a flame-retardant dielectric substrate material for a printed circuit and a preparation method of the flame-retardant dielectric substrate material. The material comprises components in parts by weight as follows: 30-50 parts of polyethylene elastomers, 30-50 parts of polyurethane elastomers, 10-30 parts of ethylene propylene diene monomers and 6-15 parts of a fire retardant. The material is characterized in that the fire retardant is a compound of dendritic organic montmorillonite and hyperbranched polyphosphoester. According to the flame-retardant dielectric substrate material and the preparation method, the compound of the dendritic organic montmorillonite and the hyperbranched polyphosphoester is adopted for flame-retardant modification, so that the prepared dielectric substrate material has an excellent flame-retardant property and processing performance and is environment-friendly, so that an application market of mineral resources such as montmorillonite and the like can be easily opened up, particularly, application requirements of the flame-retardant dielectric substrate material to the printed circuit can be well met, and the flame-retardant dielectric substrate material has potential economic benefits and profound environmental protection and safety significance.

Description

technical field [0001] The invention relates to a flame-retardant dielectric substrate material for printed circuits and a preparation method thereof, belonging to the technical field of functional materials. Background technique [0002] With the development of science and technology, people put forward higher and higher requirements for the miniaturization and high precision of electronic devices. Flame retardant and flexible printed circuits made of copper clad laminates play an increasingly important role. The printed circuit is widely used in fields such as computers and mobile phones. Copper clad laminate is a board with a layer of copper on the insulating board. The one with copper skin on one side is called single-sided board, and the one with copper skin on two sides is called double-sided board. There are three types of copper skin: 18μ, 35μ, and 70μ. After etching, various circuits can be formed, connected with various electronic components, and various electr...

Claims

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Application Information

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IPC IPC(8): C08L23/06C08L75/04C08L23/16C08L87/00C08K9/04C08K3/34B29B7/72B29C35/02
Inventor 王锦成潘晨杜有成王军华孙一博赵雯
Owner SHANGHAI UNIV OF ENG SCI
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