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Flame-retardant dielectric substrate material for printed circuit and preparation method of flame-retardant dielectric substrate material

A technology for dielectric substrates and printed circuits, applied in the field of functional materials, can solve the problems of limited application fields, decreased application performance of rigid copper clad laminates, easy cracking of the substrate, etc., and achieves excellent flame retardant performance and processing performance, environment-friendly, economical far-reaching effect

Active Publication Date: 2013-09-04
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For rigid copper-clad laminates added with ordinary flame retardants, even if they are very thin, the substrate is easily broken when bent by external force
Therefore, the application performance of ordinary flame retardant flame retardant rigid copper clad laminates is reduced, which limits its application field to a certain extent.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Adjust the roller temperature of the plastic mill to 180°C, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM masterbatch into the mill in turn to make it mix Mix evenly (about 60min); adjust the roller distance of the open mill to 3mm, add 1 gram of dendritic organic montmorillonite to make it evenly mixed (about 20min); adjust the roller distance to 1mm, and continue mixing until the rubber The surface is smooth and free of gaps (about 10min); adjust the roller distance of the open mill to 3mm, add 5 grams of hyperbranched polyphosphate to make it evenly mixed (about 20min); adjust the roller distance to 1mm, and press the rubber roller to extrude the sheet , on a flat vulcanizer at 220° C. under a pressure of 12 MPa for 10 minutes, and then at room temperature and under a pressure of 12 MPa for 20 minutes to obtain the flame-retardant dielectric substrate material.

[0026] The test data of te...

Embodiment 2

[0028] Adjust the roller temperature of the plastic mill to 200°C, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM masterbatch into the mill in turn to make it mix Mix evenly (about 50min); adjust the roller distance of the open mill to 4mm, add 3 grams of dendritic organic montmorillonite to make it evenly mixed (about 25min); adjust the roller distance to 1.5mm, and continue mixing until the rubber The surface of the material is smooth and free of gaps (about 15min); adjust the roller distance of the open mill to 4mm, add 8 grams of hyperbranched polyphosphate to make it evenly mixed (about 25min); adjust the roller distance to 1.5mm, and roll the rubber material The sheet is released, pressurized on a flat vulcanizing machine at 210°C and 13MPa pressure for 15 minutes, and then at room temperature and 11MPa pressure for 25 minutes to obtain the flame-retardant dielectric substrate material.

[0029...

Embodiment 3

[0031] Adjust the roller temperature of the plastic mill to 220°C, and put 40 grams of polyethylene elastomer masterbatch, 40 grams of polyurethane elastomer masterbatch, and 20 grams of EPDM masterbatch into the mill in turn to make it mix Mix evenly (about 40min); adjust the roller distance of the open mill to 5mm, add 5 grams of dendritic organic montmorillonite to make it evenly mixed (about 30min); adjust the roller distance to 12mm, and continue mixing until the rubber The surface is smooth and free of gaps (about 20min); adjust the roller distance of the open mill to 5mm, add 10 grams of hyperbranched polyphosphate to make it evenly mixed (about 30min); adjust the roller distance to 2mm, and press the rubber roller to extrude the sheet , on a flat vulcanizing machine at 200° C. under a pressure of 15 MPa for 20 minutes, and then at room temperature and under a pressure of 10 MPa for 30 minutes to obtain the flame-retardant dielectric substrate material.

[0032] The tes...

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PUM

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Abstract

The invention discloses a flame-retardant dielectric substrate material for a printed circuit and a preparation method of the flame-retardant dielectric substrate material. The material comprises components in parts by weight as follows: 30-50 parts of polyethylene elastomers, 30-50 parts of polyurethane elastomers, 10-30 parts of ethylene propylene diene monomers and 6-15 parts of a fire retardant. The material is characterized in that the fire retardant is a compound of dendritic organic montmorillonite and hyperbranched polyphosphoester. According to the flame-retardant dielectric substrate material and the preparation method, the compound of the dendritic organic montmorillonite and the hyperbranched polyphosphoester is adopted for flame-retardant modification, so that the prepared dielectric substrate material has an excellent flame-retardant property and processing performance and is environment-friendly, so that an application market of mineral resources such as montmorillonite and the like can be easily opened up, particularly, application requirements of the flame-retardant dielectric substrate material to the printed circuit can be well met, and the flame-retardant dielectric substrate material has potential economic benefits and profound environmental protection and safety significance.

Description

technical field [0001] The invention relates to a flame-retardant dielectric substrate material for printed circuits and a preparation method thereof, belonging to the technical field of functional materials. Background technique [0002] With the development of science and technology, people put forward higher and higher requirements for the miniaturization and high precision of electronic devices. Flame retardant and flexible printed circuits made of copper clad laminates play an increasingly important role. The printed circuit is widely used in fields such as computers and mobile phones. Copper clad laminate is a board with a layer of copper on the insulating board. The one with copper skin on one side is called single-sided board, and the one with copper skin on two sides is called double-sided board. There are three types of copper skin: 18μ, 35μ, and 70μ. After etching, various circuits can be formed, connected with various electronic components, and various electr...

Claims

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Application Information

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IPC IPC(8): C08L23/06C08L75/04C08L23/16C08L87/00C08K9/04C08K3/34B29B7/72B29C35/02
Inventor 王锦成潘晨杜有成王军华孙一博赵雯
Owner SHANGHAI UNIV OF ENG SCI
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