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Resin dissolved solution of resin diamond wire and broken-wire connecting method of resin diamond wire

A technology of resin diamond wire and resin solution, applied in chemical instruments and methods, metal sawing equipment, metal processing equipment, etc., can solve problems such as poor finished products and increased costs, and achieve the effect of reducing processing costs and meeting cutting needs.

Inactive Publication Date: 2013-09-11
GCL POLY ENERGY HLDG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide a resin solution for resin diamond wire and its disconnection connection method for the above-mentioned problems of defective finished products and increased cost due to the disconnection of the resin diamond wire

Method used

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  • Resin dissolved solution of resin diamond wire and broken-wire connecting method of resin diamond wire
  • Resin dissolved solution of resin diamond wire and broken-wire connecting method of resin diamond wire
  • Resin dissolved solution of resin diamond wire and broken-wire connecting method of resin diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] 1) Clean the broken ends of the two resin diamond wires.

[0053] 2) Dip the broken end of the resin diamond wire after cleaning into the above-mentioned resin solution of the resin diamond wire to dissolve. The dissolution time is 30 seconds, and the temperature of the resin solution of the resin diamond wire is 90 degrees Celsius.

[0054] Wherein, the mass percentages of each component in the resin solution of resin diamond wire are respectively:

[0055] The dissolving agent is 10% by mass of potassium hydroxide solution, the detergent is 40% by mass of ethanol solution, the solubilizer is 2% by mass of sodium oleate solution, and the balance is water.

[0056] 3) Clean and dry the broken end of the dissolved resin diamond wire;

[0057] 4) Weld the broken ends of the two dried resin diamond wires together.

[0058] Please refer to figure 2 , this figure shows the original state diagram before the resin diamond wire resin layer is dissolved, using the resin solu...

Embodiment 2

[0061] 1) Clean the broken ends of the two resin diamond wires.

[0062] 2) Dip the broken end of the resin diamond wire after cleaning into the above-mentioned resin solution of the resin diamond wire to dissolve, the dissolution time is 60 seconds, and the temperature of the resin solution of the resin diamond wire is 70 degrees Celsius.

[0063] Wherein, the mass percentages of each component in the resin solution of resin diamond wire are respectively:

[0064] The dissolving agent is 50% by mass sodium hydroxide solution, the detergent is 30% by mass isopropanol solution, the solubilizer is 5% by mass polyoxyethylene lauryl ether solution, and the balance is water.

[0065] 3) Clean and dry the broken end of the dissolved resin diamond wire;

[0066] 4) Weld the broken ends of the two dried resin diamond wires together.

[0067] The wire saw obtained after welding by the resin diamond wire broken wire connection method is subjected to a tension test after annealing and ...

Embodiment 3

[0069] 1) Clean the broken ends of the two resin diamond wires.

[0070] 2) Dip the broken end of the resin diamond wire after cleaning into the above-mentioned resin solution of the resin diamond wire to dissolve. The dissolution time is 300 seconds, and the temperature of the resin solution of the resin diamond wire is 30 degrees Celsius.

[0071] Wherein, the mass percentages of each component in the resin solution of resin diamond wire are respectively:

[0072] The dissolving agent is 0.05% by mass percentage of calcium hydroxide solution and 30% sodium hydroxide solution, the detergent is 30% by mass percentage of ethanol solution and 5% isopropanol solution, and the solubilizer is 2% by mass percentage of Polyoxyethylene fatty alcohol solution, the balance is water.

[0073] 3) Clean and dry the broken end of the dissolved resin diamond wire;

[0074] 4) Weld the broken ends of the two dried resin diamond wires together.

[0075] The wire saw obtained after welding b...

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Abstract

The invention provides a resin dissolved solution of a resin diamond wire. The resin dissolved solution of the resin diamond wire comprises the following components in percentage by weight: 20%-80% of dissolving agent, 2%-40% of washing agent, 0.2%-5% of solubilizer and 10%-80% of pure water. The resin dissolved solution can be used in a resin diamond wire saw broken-wire connecting method. The method comprises the following steps of: cleaning broken heads of two resin diamond wire saw broken wires and immersing the broken heads into the resin dissolved solution for dissolving; cleaning and drying the broken heads of the dissolved resin diamond wire saw broken wires and welding the broken heads of the two resin diamond wire saw broken wires together. According to the resin dissolved solution of the resin diamond wire and the broken-wire connecting method of the resin diamond wire disclosed by the invention, the resin dissolved solution is used for dissolving and corroding a redundant resin layer on the end head of the resin diamond wire to weld after removing the redundant resin layer. In a wire welding process, the core wire inside the resin diamond wire can be completely fused, so that the tensile strength after the wire welding can satisfy the cutting needs, and therefore, the processing cost is reduced.

Description

technical field [0001] The invention relates to a disconnection connection technology of a resin diamond wire saw, in particular to a resin solution for a resin diamond wire and a disconnection connection method for dissolving and disconnecting a section of a resin diamond wire saw. Background technique [0002] With the advancement of science and technology and the development of modern industry, the application of hard and brittle materials such as silicon, quartz or ceramics is becoming more and more extensive, especially in the manufacture of various semiconductor or photovoltaic devices, due to the high hardness and brittleness of the processed workpiece, these processing The workpiece is prone to irreparable damage during the cutting process, thereby reducing its yield. [0003] The currently commonly used cutting technologies include free abrasive wire saw and fixed abrasive wire saw slicing technology. Compared with the processing technology of wire saw cutting with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D7/60C11D7/50B23D63/00
Inventor 李鹏鲲吉鑫熊海英
Owner GCL POLY ENERGY HLDG
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