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High-strength temperature resistance porous phenolic resin foam and preparation method thereof

A technology of phenolic resin foam and phenolic resin, which is applied in the field of phenolic resin foam and its preparation, can solve the problems of insufficient mechanical strength, insufficient temperature resistance, insufficient water absorption, and easy slag drop, and achieve enhanced mechanical strength and temperature resistance High performance, not easy to drop slag, good compatibility effect

Inactive Publication Date: 2015-03-11
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing phenolic resin foams are closed-cell thermal insulation materials. The closed-cell thermal insulation phenolic resin foam materials are brittle, easy to drop slag, and the mechanical strength is not high enough, and the temperature resistance and water absorption are not good enough.
Superabsorbent phenolic foam and phenolic flower mud have been reported in the literature before, but there are few related reports on open-cell phenolic resin foam and its preparation and chemical reinforcement modification of open-cell phenolic resin

Method used

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  • High-strength temperature resistance porous phenolic resin foam and preparation method thereof
  • High-strength temperature resistance porous phenolic resin foam and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 1. Synthetic resin and chemical modification

[0042] Add 94 parts of phenol and 30 parts of epoxy resin (brand: E51: ESR618, purchased from Nantong Xingchen Synthetic Materials Co., Ltd.) into the three-necked flask, stir at room temperature for 5 minutes until uniform, and then add 20 parts of 20wt% to the three-necked flask NaOH aqueous solution, heated and stirred for 15 minutes; when the temperature rose to 80°C, 56.85 parts of solid formaldehyde were added in 4 batches on average, and the time interval between each batch was 10 minutes; after 3.0h, the reaction was terminated, and the obtained modified phenolic The resin was cooled to room temperature.

[0043] 2. Foaming and curing

[0044]1) Add 100 parts of modified phenolic resin and 2 parts (combined with 1 part of simethicone and 1 part of sodium dodecylsulfonate (SDS)) of compound surfactant in sequence to a high-speed mixer at room temperature, and Stir for 5 minutes;

[0045] 2) Then add 4 parts of...

Embodiment 2

[0052] 1. Synthetic resin and chemical modification

[0053] Add 94 parts of phenol and 14.1 parts of epoxy resin (brand E51: ESR618, purchased from Nantong Xingchen Synthetic Materials Co., Ltd.) into a three-necked flask, stir at room temperature for 5 minutes until uniform, and then add 22 parts of 20wt% NaOH aqueous solution, heated and stirred for 10 minutes; when the temperature rose to 80°C, 56.85 parts of solid formaldehyde were added in 4 batches on average, and the time interval between each batch was 10 minutes; after 3.0h, the reaction was completed, and the obtained modified phenolic resin Cool to room temperature.

[0054] 2. Foaming and curing

[0055] 1) Add 150 parts of modified phenolic resin and 8 parts (combined with 2 parts of OP-10 and 6 parts of SDS) of compound surfactant in turn into a high-speed mixer at room temperature, and stir at high speed for 5 minutes;

[0056] 2) Then add 12 parts of cyclopentane and stir at high speed for 1 minute to obtai...

Embodiment 3

[0063] 1. Synthetic resin and chemical modification

[0064] Add 94 parts of phenol and 14.1 parts of epoxy resin (brand name: E44 (Phoenix brand)) into the three-necked flask, stir at room temperature for 5 minutes until uniform, then add 24.6 parts of 20wt% NaOH aqueous solution to the three-necked flask, heat and Stir for 13 minutes; when the temperature rises to 80°C, add 56.85 parts of solid formaldehyde in 4 batches on average, with an interval of 10 minutes between each batch; after 3.0 hours, the reaction is terminated, and the obtained modified phenolic resin is cooled to room temperature.

[0065] 2. Foaming and curing

[0066] 1) Add 100 parts of modified phenolic resin and 4 parts (combined with 1.3 parts of Tween-80 and 2.7 parts of SDS) of compound surfactant in sequence to a high-speed mixer at room temperature, and stir at high speed for 5 minutes;

[0067] 2) Then add 10 parts of cyclopentane and stir at high speed for 1 minute to obtain a resin mixture;

...

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Abstract

The invention provides high-strength temperature resistance porous phenolic resin foam and a preparation method thereof. The high-strength temperature resistance porous phenolic resin foam is prepared by foaming and solidifying the following components in parts by weight: 100-160 parts of modified phenolic resin, 2-8 parts of surfactant, 4-12 parts of foaming agent and 8-15 parts of solidifying agent. According to the preparation method of the high-strength temperature resistance porous phenolic resin foam, different types of epoxy resin are used for synthesizing the modified phenolic resin, mechanical strength and temperature resistance of phenolic resin foam can be obviously enhanced under the condition that the solidified and foamed porous structure of resin is not influenced; a mixed surfactant of a non-ionic surfactant and an anion surfactant and a mixed acid complex solidifying agent are adopted, formation of the porous structure can be effectively guaranteed, a phenolic resin synthesis and modification processes are easy to operate, and industrialization is easy to realize.

Description

technical field [0001] The invention belongs to the technical field of phenolic resin foam and its preparation, and in particular relates to a high-strength, temperature-resistant open-cell phenolic resin foam and a preparation method thereof. Background technique [0002] The characteristic of open-cell foam is that the cell structure in the material is open, which can form complex channels, allowing small molecule gases or fluids to flow through the material. Most of them are formed by supercritical foaming, and pure physical foaming is still rare. Open-cell phenolic resin foam is a new type of open-cell phenolic resin foam. The cells in the plastic foam are open, and the bubbles are connected to each other. The gas phase and the plastic in the foam are continuous phases of open-cell foam. [0003] Most of the existing phenolic resin foams are closed-cell thermal insulation materials. The closed-cell thermal insulation phenolic resin foam materials are brittle, easy to d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/14C08J9/14C08G8/28
Inventor 李瑞海徐前荆帅林刘川崔梦雅胡静
Owner SICHUAN UNIV
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