Photosensitive composition, hardened coating films therefrom, and printed wiring boards using same
A photosensitive composition and composition technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of not being able to obtain a circuit pattern with a high aspect ratio thick film, and not propose a photosensitive composition, and achieve a sufficient surface Effects of curability, halation prevention, and characteristic improvement
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[0182] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated in detail, this invention is not limited to a following example. In addition, the following "parts" and "%" are all based on mass unless otherwise specified.
Synthetic example 1
[0184] Put 220 parts (1 equivalent) of Epiclon N-695 (manufactured by DIC Corporation, epoxy equivalent = 220) of cresol novolac type epoxy resin into a four-necked flask equipped with a stirrer and a condensing reflux device, and add Carbit 216 parts of alcohol acetate, heated and dissolved. Then, 0.46 parts of methylhydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated to 95-105 degreeC, and 57.6 parts (0.8 equivalents) of acrylic acid and 34 parts (0.2 equivalents) of p-phenylphenol were dripped slowly, and it was made to react for 16 hours. The reaction product (hydroxyl group: 1 equivalent) was cooled to 80 to 90° C., 87 parts (0.56 equivalent) of tetrahydrophthalic anhydride was added, reacted for 8 hours, cooled, and taken out. In the thus obtained carboxyl group-containing photosensitive resin, the non-volatile content was 65%, and the acid value of the solid matter was 80 mgKOH / g. H...
Embodiment 1
[0199] Each composition of the photosensitive resists A to K diluted to 400dPa·s with dipropylene glycol monomethyl ether was printed on a copper foil etching substrate (FR-4 substrate) of 1.6mm glass epoxy resin respectively, at 90 The substrates were dried at °C for 30 minutes to obtain substrates on which resist films with dry film thicknesses of 300 μm and 400 μm were formed. Thereafter, using an ultra-high pressure mercury lamp exposure device (manufactured by ORC Corporation), the ultraviolet light was 400mJ / cm 2 Under the condition of , draw a pattern with a minimum line & space of 300μm. Thereafter, using a 30° C. 1 wt % sodium carbonate aqueous solution, development was performed at a spray pressure of 2 atmospheres, and water washing was repeated twice to obtain a substrate on which a photosensitive resist pattern was formed. The substrate thus obtained was cured at 150° C. for 1 hour in a hot air drying oven.
[0200] Then, use an electroless copper plating soluti...
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