Method for metallizing surface of alumina ceramic substrate

A technology on the surface of alumina ceramics and substrates, which is applied in the direction of metal material coating process, liquid chemical plating, coating, etc. It has catalytic activity, can not be applied to patch skeleton and other problems, and achieves the effect of good membrane base bonding, good coating compactness and easy operation

Active Publication Date: 2013-12-25
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The following problems are often encountered in the metallization process of alumina ceramics: low metallization strength, poor film adhesion, low density, light transmission on the metallized surface, easy oxidation, etc.
The traditional Mn-Mo sintering method not only consumes a lot of energy due to high temperature sintering, but also cannot be applied to the patch skeleton made of high molecular polymers, etc.
Although the electroplating method has strong bonding force with ceramics and small internal stress, the obvious disadvantage is that it is greatly affected by the cleanliness of the surface of the metallized porcelain and the purity of the plating solution.
Electroless plating is one of the more common methods for ceramic metallization, but because the surface of alumina ceramic substrates does not have catalytic activity, in industrial production, catalytic activation treatment containing noble metals is generally required, but the process is complicated because it contains noble metals such as Pd

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  • Method for metallizing surface of alumina ceramic substrate
  • Method for metallizing surface of alumina ceramic substrate
  • Method for metallizing surface of alumina ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Coarsening preprocessing

[0024] The alumina ceramic substrate was placed in the roughening solution at room temperature and in an air atmosphere, ultrasonically treated for 30 minutes, and then rinsed with deionized water to obtain a pretreated substrate.

[0025] The roughening solution is an aqueous solution of hydrofluoric acid and ammonium fluoride, the concentration of hydrofluoric acid in the roughening solution is 40ml / L, and the concentration of ammonium fluoride is 2g / L.

[0026] 2. Primary nickel plating

[0027] Put the pretreated alumina ceramic sample into the plating solution Ⅰ, adjust the pH to 10 with sodium hydroxide, and conduct ultrasonic deposition for 50 minutes. The ultrasonic frequency of ultrasonic deposition is 40KHz, and the power is 300W. After the reaction is completed, the sample , washed with deionized water, dried in an oven at 90° C. for 3 hours, and cooled at room temperature to obtain a nickel-plated substrate.

[0028] Described...

Embodiment 2

[0034] 1. Coarsening preprocessing

[0035] The alumina ceramic substrate was placed in the roughening solution at room temperature and in an air atmosphere, ultrasonically treated for 40 minutes, and then rinsed with deionized water to obtain a pretreated substrate.

[0036] The roughening solution is an aqueous solution of hydrofluoric acid and ammonium fluoride, the concentration of hydrofluoric acid in the roughening solution is 60ml / L, and the concentration of ammonium fluoride is 4g / L.

[0037] 2. Primary nickel plating

[0038] Put the pretreated alumina ceramic sample into the plating solution Ⅰ, adjust the pH to 11 with sodium hydroxide, and conduct ultrasonic deposition for 40 minutes. The ultrasonic frequency of ultrasonic deposition is 40KHz and the power is 300W. After the reaction is completed, take out the sample , washed with deionized water, dried in an oven at 100° C. for 4 hours, and cooled at room temperature to obtain a nickel-plated substrate.

[0039] ...

Embodiment 3

[0045] 1. Coarsening preprocessing

[0046] The alumina ceramic substrate was placed in the roughening solution at room temperature and in an air atmosphere, ultrasonically treated for 20 minutes, and then rinsed with deionized water to obtain a pretreated substrate.

[0047] The roughening solution is an aqueous solution of hydrofluoric acid and ammonium fluoride, the concentration of hydrofluoric acid in the roughening solution is 20ml / L, and the concentration of ammonium fluoride is 1g / L.

[0048] 2. Primary nickel plating

[0049]Put the pretreated alumina ceramic sample into the plating solution Ⅰ, adjust the pH to 11 with sodium hydroxide, and conduct ultrasonic deposition for 60 minutes. The ultrasonic frequency of ultrasonic deposition is 40KHz, and the power is 300W. Take out the sample after the reaction is completed , washed with deionized water, dried in an oven at 80° C. for 2 hours, and cooled at room temperature to obtain a nickel-plated substrate.

[0050] De...

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Abstract

The invention discloses a method for metallizing surface of an alumina ceramic substrate. The method comprises unit processes of coarsening pretreatment, primary nickel plating and secondary copper plating, wherein the coarsening pretreatment comprises: ultrasonically treating the alumina ceramic substrate in coarsening liquid for 20-40 min, and then, washing the alumina ceramic substrate through deionized water to obtain a pre-treated substrate; the primary nickel plating comprises: putting the pre-treated substrate in a plating solution I, ultrasonically depositing for 40-60 min at room temperature, washing the pre-treated substrate through deionized water after taking out the same, and drying the pre-treated substrate to obtain a nickel-plated substrate; the secondary copper plating comprises: putting the nickel-plated substrate in a plating solution II, reacting at 60-80 DEG C for 40-60 min, taking out the nickel-plated substrate after cooling the same, washing the nickel-plated substrate through deionized water, and drying the nickel-plated substrate to obtain a copper-plated substrate. A metal copper layer on the surface of the alumina ceramic substrate prepared by the method disclosed by the invention is good in combination with the substrate, good in coating density and uniform in structure components.

Description

1. Technical field [0001] The invention relates to a method for metallizing the surface of an alumina ceramic substrate. Copper plating on the surface of the alumina ceramic substrate is completed through secondary chemical plating. 2. Background technology [0002] Surface metallization of alumina ceramic substrates can connect ceramics and metals to form composite substrates. It combines the excellent mechanical properties of ceramic materials with the excellent thermal and electrical conductivity of metal materials. It is the key technology for the production of electric vacuum ceramic devices. The following problems are often encountered in the metallization process of alumina ceramics: low metallization strength, poor film adhesion, low density, light transmission on the metallized surface, and easy oxidation. These not only lead to a decrease in yield, but also affect product quality. Therefore, continuous research to improve the level of metallization technology is ve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/18
Inventor 罗来马卢泽龙吴玉程程继贵
Owner HEFEI UNIV OF TECH
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