A process method for surface treatment of electrolytic copper foil and the treated copper foil

Abstract

The present invention discloses a one-time surface treatment method for electrolysis copper foil. The process method comprises: 1, coursing solution preparation: carrying out mixing dissolving on cathode cooper, sulfuric acid and soft water to produce a copper sulfate solution, adding an additive A to the copper sulfate solution, completely mixing, and adding the obtained mixture to a coursing tank to be subjected to electroplating; 2, curing solution preparation: carrying out mixing dissolving on cathode cooper, sulfuric acid and soft water to produce a copper sulfate solution, and adding the copper sulfate solution to a curing tank to be subjected to electroplating; 3, zinc plating alloy solution preparation and a passivation treatment: respectively dissolving zinc sulfate, chromic anhydride and phosphoric acid, adding the zinc sulfate solution to a chromic acid and phosphoric acid mixed solution, adding an additive D solution to the obtained mixing solution in a dropwise manner while adjusting the pH value by using sodium hydroxide, completely mixing, and then adding the obtained mixture to a zinc plating alloy tank to be subjected to electroplating; and 4, spray coating of an adhesive: dissolving an adhesive in water, and carrying out cycle spray coating of the adhesive on the surface of copper foil. According to the present invention, the process is simple, the steps are less, passivation solution components are stable, and the treated electrolysis copper foil has excellent physical properties.

Description

technical field [0001] The invention relates to a surface treatment process of electrolytic copper foil, belonging to the technical field of electrolytic copper foil treatment process. Background technique [0002] Electrolytic copper foil is an important material for printed circuit boards, mainly used in the fields of electronic computers, industrial control, aerospace and all electrical appliances. In recent years, with the rapid development of the domestic electronic information industry, the demand for copper foil for printed circuit boards and its upstream products has also increased, which has brought good market prospects and development opportunities for the electrolytic copper foil industry. According to the investigation of the Printed Circuit Branch of the China Electronic Components Industry Association, my country has become a major exporter of printed circuit boards. The importance of electrolytic copper foil in the modernization of industry and national defe...

AI Technical Summary

Problems solved by technology

Although this invention solves the defect of unsatisfactory hydrochloric acid resistance in the treatment process of pure zinc plating on the surface of copper foil, and improves the anti-oxidation ability of electrolytic copper foil at room temperature and high temperature, the process steps are complicated, and the quality of electroplating is not only related to the electroplating process. It is also closely related to the electroplating solution. In the Chinese invention patent 200610070549.3, the copper foil is treated with a weakly roughened electroplating solution under acidic conditions, a zinc alloy electroplating solution under alkaline conditions, and a chromate passivation electroplating solution. Continuous production leads to the formation of precipitation in the electrolyte. At the same time, the treatment has gone through 6 process steps, and the control range of the components is small, which affects the passivation effect, so the production process is complicated.

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