Mica heating substrate coated with inorganic thick film, preparing method therefore and heating assembly

Abstract

The invention provides a mica heating substrate coated with an inorganic thick film. The mica heating substrate comprises a mica substrate carrier, the face-type inorganic thick film, electrodes, wire leading ends and a mica cover plate, wherein the face-type inorganic thick film is arranged on the first surface of the mica substrate carrier in a high-temperature sintering mode, the electrodes enable the inorganic thick film to be connected into a circuit, the wire leading ends are used for being connected with power source lead wires, and the mica cover plate is attached to the mica substrate carrier to cover the inorganic thick film, the electrodes and the wire leading ends. The inorganic thick film comprises graphite powder, bismuth oxide, boric oxide, silicon dioxide, antimonous oxide, zinc oxide, strontium carbonate and the like. The mica heating substrate which is healthy and environmentally friendly is obtained, short circuits, ignition and the excessively high oxidation speed of an electric heating wire are prevented from being caused by the excessively large partial expansion coefficient of mica, and the defects that a rubber layer of a traditional mica heating substrate is prone to aging, blistering and layering are partially generated, the resistance is damped, and the temperature is uneven are overcome. The invention further provides a preparing method of the mica heating substrate and a mica heating assembly with the mica heating substrate.

Description

technical field [0001] The invention belongs to the field of new electrothermal materials, and in particular relates to a mica heating substrate coated with an inorganic thick film, a preparation method thereof and a heating component. Background technique [0002] The mica heating plate is a traditional electric heating element. It adopts the conventional circuit board production process. There are alloy sheets etched on the back of the mica plate or electric heating wires or electric heating bands are wound on the mica substrate, and transparent electric heating films are also prepared on the mica substrate, etc. The product defect of the mica heating plate with the composite structure as the heat source is that it needs to use a large amount of harmful substances such as strong acid during production (etching process), which will produce three wastes, which are harmful to human body and seriously pollute the environment. When the product is working, because the product is...

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Problems solved by technology

[0002] The mica heating plate is a traditional electric heating element. It adopts the conventional circuit board production process. There are alloy sheets etched on the back of the mica plate or electric heating wires or electric heating bands are wound on the mica substrate, and transparent electric heating films are also prepared on the mica substrate, etc. The product defect of the mica heating plate with the composite structure as the heat source is that it needs to use a large amount of harmful substances such as strong acid in the production (etching process), and there are three wastes, which are harmful to the human body and seriously pollute the environment.

When the product is working, because the product is a "linear" heat source heating structure, the power density per unit cross-sectional area is high, the surface temperature is high, the local expansion coefficient is large, and it is easy to deform. There is noise when working. In the place where the heating wire is prepared, the temperature is very high. The local expansion coefficient of mica is too large, resulting in abnormal conditions such as electric heating wire short circuit, ignition, and rapid oxidation; because the glue used in the product to compound mica is made of organic materials, there is a peculiar smell and a large amount of gas and harmful smoke are produced during work; Due to the composite structure of the product, the long-term high-temperature intermediate adhesive layer is easy to age and delaminate, which will cause the mica carrier and the heating element to age and delaminate, resulting in air thermal resistance, resulting in fire and excessive product aging.

[0003] At present, the mica board made of transparent electrothermal film on the market, due to the large area of ​​the single-chip product, uneven product square resistance and poor repeatability, therefore, the technical indicators of the single-chip structure product cannot be achieved.

The existing product structure is a multi-piece assembly structure, but the resistance of each piece is different, resulting in uneven surface temperature of the product. After working for a certain period of time, the total power of the product is attenuated by about 20%, and this product has been gradually eliminated.

[0004] Compared with today's highly developed science and technology, the above-mentioned series of technologies are obviously not applicable to people's constant pursuit of health and environmental protection.

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