Alkali developing-type photosensitive resin composition and dry film as well as cured material and printed circuit board

A photosensitive resin, alkali developing type technology, applied in the formed alkali developing type photosensitive resin composition, dry film, curing field, can solve problems such as adverse effects, achieve good characteristics, excellent storage stability, biodegradability excellent effect

Inactive Publication Date: 2014-01-15
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although petroleum-based aromatic solvents have excellent solubility in organic raw materials, they contain naphthalene, a suspected carcinogen, and due to concerns about adverse effects on the human body, countermeasures have been sought

Method used

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  • Alkali developing-type photosensitive resin composition and dry film as well as cured material and printed circuit board
  • Alkali developing-type photosensitive resin composition and dry film as well as cured material and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0114] Put 214 parts of EPICLON N-695 (manufactured by DIC Corporation, epoxy equivalent = 214) of cresol novolak type epoxy resin into a four-necked flask equipped with a stirrer and reflux condenser, and add 103 parts of carbitol Acetate, 103 parts of dibasic acid ester solvent (manufactured by Du Pont, trade name: DBE [dimethyl adipate: 10~25%, dimethyl glutarate: 55~65%, dimethyl succinate Esters: 15~25%]) and heated to dissolve. Next, 0.1 part of hydroquinone as a polymerization inhibitor and 2.0 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated at 95-105 degreeC, and 72 parts of acrylic acid were dripped slowly, and it was made to react for 16 hours. Cool the obtained reaction product to 80~90°C, add 91.2 parts of tetrahydrophthalic anhydride, react for 8 hours, take it out after cooling. The carboxyl group-containing photopolymerizable unsaturated compound thus obtained had a nonvolatile content of 65%, and an acid value of solid m...

Synthetic example 2

[0116] Put 214 parts of EPICLON N-695 (manufactured by DIC Corporation, epoxy equivalent = 214) of cresol novolak type epoxy resin into a four-necked flask equipped with a stirrer and reflux condenser, and add 103 parts of carbitol Acetate, 103 parts of petroleum-based aromatic solvents (manufactured by Idemitsu Kosan, trade name: IPZOLE 150) were heated and dissolved. Next, 0.1 part of hydroquinone as a polymerization inhibitor and 2.0 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated at 95-105 degreeC, and 72 parts of acrylic acid were dripped slowly, and it was made to react for 16 hours. Cool the obtained reaction product to 80~90°C, add 91.2 parts of tetrahydrophthalic anhydride, react for 8 hours, take it out after cooling. The carboxyl group-containing photopolymerizable unsaturated compound thus obtained had a nonvolatile content of 65%, and an acid value of solid matter of 87.5 mgKOH / g. Hereinafter, the solution of this reaction ...

Synthetic example 3

[0118] Put 214 parts of EPICLON N-695 (manufactured by DIC Corporation, epoxy equivalent = 214) of cresol novolak type epoxy resin into a four-necked flask equipped with a stirrer and reflux condenser, and add 103 parts of carbitol Acetate, 103 parts of dipropylene glycol monomethyl ether (manufactured by Toho Chemical Industry, trade name: Hissolve DPM) were dissolved by heating. Next, 0.1 part of hydroquinone as a polymerization inhibitor and 2.0 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated at 95-105 degreeC, and 72 parts of acrylic acid were dripped slowly, and it was made to react for 16 hours. Cool the obtained reaction product to 80~90°C, add 91.2 parts of tetrahydrophthalic anhydride, react for 8 hours, take it out after cooling. The carboxyl group-containing photopolymerizable unsaturated compound thus obtained had a nonvolatile content of 65%, and an acid value of solid matter of 87.5 mgKOH / g. Hereinafter, the solution of th...

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Abstract

The invention provides an alkali developing-type photosensitive resin composition and a dry film as well as a cured material and a printed circuit board. The alkali developing-type photosensitive resin composition does not contain coarse grains, contains few substances harmful to human bodies, has excellent storage stability and can be used for inhibiting the worsening of operating environments. The alkali developing-type photosensitive resin composition is characterized by containing a carboxyl-containing resin (A), a photopolymerization initiator (B), a compound (C) with more than two olefinic unsaturated groups in one molecule, and dibasic acid ester (D).

Description

technical field [0001] The present invention relates to an alkali-developable photosensitive resin composition, dry film, cured product, and printed circuit board suitable for forming solder resists and the like for printed circuit boards, and particularly relates to an alkali-developable photosensitive resin composition capable of forming no coarse grains, excellent storage stability, and Alkali-developable photosensitive resin composition that suppresses the deterioration of the work environment and is less harmful to the human body. An alkali-developable photosensitive resin composition that cures the pattern of the coating film. Coating the photosensitive resin composition on a carrier film, A dry film obtained by drying, a cured product of the photosensitive composition or the dry film, and a printed wiring board including the cured product. Background technique [0002] At present, in the solder resists of some printed circuit boards for civilian use and most of the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027H05K3/28
CPCG03F7/027G03F7/032G03F7/0385G03F7/0388G03F7/322H05K3/287H05K3/281H05K3/3452
Inventor 加藤贤治
Owner TAIYO INK SUZHOU
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