Tail gas treatment device and tail gas treatment method in process of recycling waste printed circuit boards

A printed circuit board and exhaust gas treatment technology, which is applied in combustion methods, separation methods, chemical instruments and methods, etc., can solve problems such as the inability to effectively remove organic gas and metal fume, and achieve the effects of low price, obvious effect and wide range of sources.

Inactive Publication Date: 2014-01-29
HEFEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technology is only aimed at the exhaust gas produced during the process of extracting glass fibers from waste PCB boards, and only part of the solid particles in the exhaust gas can be deposited by liquid immersion, but cannot effectively remove harmful organic gases and very fine metal fumes.

Method used

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  • Tail gas treatment device and tail gas treatment method in process of recycling waste printed circuit boards

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Embodiment Construction

[0037] In the present embodiment, the tail gas treatment method in the waste printed circuit board recycling process is carried out as follows:

[0038] Step 1: The tail gas to be treated is firstly treated by activated carbon adsorption to filter out solid dust (such as glass fiber, calcium carbonate, etc.), heavy metal particles (such as metal particles containing lead, cadmium, mercury, chromium), and some inorganic non-toxic substances in the tail gas. Metal oxides (such as NO 2 , SO 2 etc.) and some organic gases (such as acetone, phenol, etc.), discharge the pretreatment tail gas;

[0039] In this embodiment, the exhaust gas collection cover 1 can be connected to the exhaust gas outlet of the waste printed circuit board recovery equipment, or directly placed on the tin melting equipment, so as to minimize the harmful exhaust gas escaping into the environment; then, by placing The tail gas induced fan 3 in front of the activated carbon adsorption device collects the tai...

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Abstract

The invention discloses a tail gas treatment device and a tail gas treatment method in a process of recycling waste printed circuit boards. The tail gas treatment method comprises the following steps: performing active carbon adsorption treatment on tail gas to be treated firstly, and filtering solid dust, heavy metal particles, part of inorganic nonmetal oxide and part of organic gas in the tail gas; then introducing the pretreated tail gas into a spray tower, fully contacting the pretreated tail gas with a purification solution in the spray tower, and removing most of inorganic nonmetal oxide and part of organic gas in the pretreated gas; finally, introducing the tail gas exhausted out of the top of the spray tower into a high-temperature combustion device so as to perform combustion, and discharging non-pollution tail gas through the combustion treatment device. Through the tail gas treatment device and the tail gas treatment method, the secondary pollution problem caused by the discharged tail gas in the process of recycling the waste printed circuit boards is effectively solved; meanwhile, part of combustible gas in the tail gas is used, so that a certain economic value is achieved.

Description

technical field [0001] The invention relates to a tail gas treatment device and method in the recycling process of waste printed circuit boards. Background technique [0002] Printed Circuit Board (PCB for short) is an important part of electronic and electrical products and is widely used in various electronic and electrical equipment. With the rapid growth of China's economy, especially the rapid development of the manufacturing industry, the amount of waste electrical and electronic equipment continues to increase, and the recycling of waste printed circuit boards has become a thorny issue facing the society. [0003] In the recycling process of printed circuit boards, because there are many kinds of electronic components distributed on them, these electronic components need to be removed first. The most effective electronic component removal technology currently recognized is to use a certain method to heat the soldering surface of the PCB board, so that the solder poin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D53/78B01D53/74B01D53/00B01D53/60B01D53/72B01D46/00F23G7/06
Inventor 王玉琳齐森宋守许刘志峰刘光复
Owner HEFEI UNIV OF TECH
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