Polymer-silicon dioxide coated carbon nanotube composite material, preparation method thereof, prepreg and copper-clad substrate
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
- Publication Date
- 2014-02-05
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Abstract
Description
technical field
[0001] The invention relates to the technical field of composite materials, in particular to a polymer-silicon dioxide-coated carbon nanotube composite material, a preparation method thereof, a prepreg and a copper-clad substrate. Background technique
[0002] The copper-clad substrate (also known as the IC substrate) mainly provides support, protection and heat dissipation for the chip, and at the same time plays the role of electrical connection between the chip and the conventional printed circuit board (PCB). In recent years, electronic products are developing in the direction of portability, miniaturization, light weight and multi-function. This market demand has put forward higher and higher requirements for copper clad substrates.
[0003] Carbon nanotubes have attracted widespread attention from scientists and industries due to their excellent mechanical and thermal properties. For example, the strength of carbon nanotubes is 2 to 3 orders of magnitu...