Polymer-silicon dioxide coated carbon nanotube composite material, preparation method thereof, prepreg and copper-clad substrate

A carbon nanotube, silicon dioxide technology, used in chemical instruments and methods, electronic equipment, other household appliances, etc.
CN103554909AActive Publication Date: 2014-02-05SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
Publication Date
2014-02-05

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Abstract

The invention relates to a polymer-silicon dioxide coated carbon nanotube composite material, a preparation method thereof, a prepreg and a copper-clad substrate. The polymer-silicon dioxide coated carbon nanotube composite material comprises 5%-25% of silicon dioxide coated carbon nanotubes, 70%-90% of polymer and 0.1%-5% of catalyst by weight. The silicon dioxide has high insulation performance so that the electrical conductivity of the silicon dioxide coated carbon nanotubes is low, and consequently, the electrical conductivity of the composite material is reduced; besides, the silicon dioxide also inhibits the aggregation of the carbon nanotubes, and simultaneously is capable of having an interface reaction with the polymer; as a result, the interfacial interaction is improved and the carbon nanotubes can be evenly dispersed in the polymer; and therefore, the polymer-silicon dioxide coated carbon nanotube composite material is beneficial to preparing a copper-clad substrate which is good in mechanical properties and low in dielectric properties.
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Description

technical field

[0001] The invention relates to the technical field of composite materials, in particular to a polymer-silicon dioxide-coated carbon nanotube composite material, a preparation method thereof, a prepreg and a copper-clad substrate. Background technique

[0002] The copper-clad substrate (also known as the IC substrate) mainly provides support, protection and heat dissipation for the chip, and at the same time plays the role of electrical connection between the chip and the conventional printed circuit board (PCB). In recent years, electronic products are developing in the direction of portability, miniaturization, light weight and multi-function. This market demand has put forward higher and higher requirements for copper clad substrates.

[0003] Carbon nanotubes have attracted widespread attention from scientists and industries due to their excellent mechanical and thermal properties. For example, the strength of carbon nanotubes is 2 to 3 orders of magnitu...

Claims

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