Fluororesin heat radiation paint for LED lamp and preparation method thereof

Abstract

The invention provides a fluororesin heat radiation paint for an LED lamp, wherein the paint is prepared by the raw material by weight: 35-40 parts of polytetrafluoroethylene, 12-15 parts of E-12 epoxy resin, 5-6 parts of vinyl triamine DETA, 20-25 parts of xylene, 1-2 parts of antioxidant OD, 2-3 parts of silane coupling agent KH550, 3-4 parts of zinc acetate, 10-12 parts of silicon nitride, 1-2parts of waterless calcium chloride, 1-2 parts of europium trifluoro acetylacetonate, 1-2 parts of tetrahydrofuran, 10-12 parts of aluminum nitride powder, 14-17 parts of ethyl acetate, and 3-4 partsof film-forming auxiliary agent. Aluminum nitride powder is added to make the paint have advantages of high heat conduction rate, good heat radiation effect, long-term usage under 200 DEG C with no change of mechanical properties; silicon nitride is added to make the surface of the paint smooth and firm; polytetrafluoroethylene is used to make a formed film resist high temperature and low temperature; and the paint has advantages of large adhesion stress, not-easy shedding, and long service life.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, more specifically, a fluororesin heat dissipation coating for LED lamps and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. LED lamp heat dissipation requirements. Some manufacturers also start to select materials with higher thermal conductivity, but this will increase the p...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs