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Solder resist ink with low-energy ultraviolet curing performance

A technology of solder resist ink and ultraviolet, which is applied in the direction of ink, photoplate making process of pattern surface, photosensitive material used in optomechanical equipment, etc. advanced questions

Inactive Publication Date: 2014-02-12
上海麟多祈化工科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the existing photosensitive imaging solder resist ink, such as long pre-baking time, high baking temperature, low bonding fastness and high irradiation energy, and provide a high Low-energy radiation solder resist ink with good bonding fastness and high drying effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Polyurethane modified acrylic resin is prepared according to the following method:

[0032] Formula by weight percentage:

[0033] 1. Methyl diisocyanate 7

[0034] 2. Polyether diol 30

[0035] 3. Tetrahydrophthalic anhydride 15

[0036] 4. Dibutyltin dilaurate 2

[0037] 5. Butyl methacrylate 25

[0038] 6. Benzoyl peroxide 1

[0039] 7. Hydroxyethyl methacrylate 20

[0040] After mixing the 1-3 components in the above formula in a three-necked bottle, add 4 components dropwise, the temperature is 100-120°C, react for 4 hours, then cool down to 70-80°C, add components 5-7, continue React for 3-4 hours, cool down and discharge to prepare polyurethane modified acrylic resin.

[0041] The formula of solder resist ink is as follows:

[0042] Polyurethane modified acrylic resin 50

[0043] Epoxy Acrylic 25

[0044] Reactive Thinner 10

[0045] HZH90 Photoinitiator 5

[0046] Filler 8

[0047] Phthalocyanine blue organic pigment 2

[0048] Stir and mix all th...

Embodiment 2

[0050] Polyurethane modified acrylic resin 70

[0051] Epoxy Acrylic 6

[0052] Reactive Thinner 5

[0053] 1173 Photoinitiator 6

[0054] filler 10

[0055] cobalt blue 3

[0056] Stir and mix all the components in the ink except for the reactive diluent, grind the ink with a three-roller machine until the fineness of the ink is 8um, add the reactive diluent and stir evenly. The obtained ink has good low-energy UV drying performance, and the prepared circuit board has high temperature resistance, good gloss, and good bonding fastness to the substrate. The LEDUV light source is used for drying, which reduces energy consumption and does not generate ozone, which improves the processing efficiency of the circuit board. and environmental performance.

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PUM

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Abstract

The invention relates to solder resist ink with low-energy ultraviolet curing performance. The solder resist ink comprises the following components in percent by weight: 50%-70% of polyurethane modified acrylic resin, 5%-25% of epoxy acrylic resin, 5%-20% of a reaction diluent, 5%-10% of a photoinitiator, 7%-15% of filler, 0.5%-3% of organic pigment. A printed circuit board prepared by the formula is high-temperature resistant, free of discoloring and dropping and smooth in appearance. An LED (Light-Emitting Diode) UV (Ultraviolet) light source is adopted, so that energy consumption is lowered, ozone is not produced, and processing benefits and environment-friendly performance of the circuit board are improved.

Description

technical field [0001] The invention relates to a solder resist ink for circuit boards, in particular to a solder resist ink for photosensitive imaging with dilute alkali development. Background technique [0002] A large number of circuit boards are used in electrical products. The circuit boards range from single-sided to double-sided to multi-layer. The requirements for product precision are increasing, and higher requirements are placed on manufacturing quality and printing inks. At present, this ink is mainly produced by Taiwan Sun, Japan Tamura, and Tongxiang. Provided by New Oriental Ink, the existing photosensitive ink has long pre-baking time, high drying temperature, poor bonding fastness, and the circuit board made has poor heat resistance and poor gloss. The description of Chinese patent 02134267.9 mentions that it is a utility model, but when it is applied, it needs to be exposed to a high-pressure mercury lamp after being dried at 80°C, which has high energy an...

Claims

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Application Information

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IPC IPC(8): C09D11/101G03F7/004G03F7/027C08G18/67
Inventor 不公告发明人
Owner 上海麟多祈化工科技有限公司
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