Novel organic alkali micro-etching solution

Abstract

The invention relates to the technical field of etching solution for producing circuits in the manufacturing of printed circuit boards, in particular to a novel organic alkali micro-etching solution for forming the circuits through the a semi-additive process. The novel organic alkali micro-etching solution consists of components with the following components by mass: 0.1-15% of cupric ionization compound, 1-40% of organic alkali, 0.0001%-10% of complexing additive, 0.0001%-5% of halogen compound and the balance of water; the sum of the components in percentages by weight is 100%; the cupric ionization compound is calculated by the mass of copper ion; the halogen compound is calculated by the mass of halogen ion. The novel organic alkali micro-etching solution can completely etch seed copper layers without damaging nickel layers and gold layers, and restrains the over-etching and bottom-layer undercutting of the circuit copper layers.

Description

technical field [0001] The invention relates to the technical field of etching solution for making circuits in the manufacture of printed circuit boards, in particular to a novel organic alkali microetching solution for forming circuits by a semi-additive method. Background technique [0002] The semi-additive method is a method of making circuits in the printed circuit board process. The method forms a 0.5-2 micron thick seed copper layer on the surface of the substrate by sputter coating or chemical method, then coats the resist layer, and exposes and develops to form a resist layer pattern, and then electroplating on the seed copper layer Form the circuit layer by method, and then strip the resist layer to expose the unnecessary seed copper layer. After this step, the unnecessary seed copper layer is generally directly etched away with an etching solution to form a circuit; however, the process is further developed. After the resist layer is stripped off, the resist laye...

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Problems solved by technology

However, these potions are all acidic systems. When etching the above-mentioned circuit board with a nickel-gold layer, it will inevitably corrode the nickel layer laterally, resulting in a suspended fracture of the gold layer.

[0004] In addition, the alkaline etchant of cupric ammonium chloride-ammonia water system, which is widely used in traditional pcb manufacturing, is used to etch the copper surface of the semi-additive method. Over-etching of the electroplated copper layer will occur, and the lines will become thinner or even disconnected. The etched seed copper layer is difficult to etch clean, etc.

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