Flexible diamond abrasive disc and manufacturing and polishing technology thereof

Abstract

The invention relates to a flexible diamond abrasive disc and a manufacturing and polishing technology of the flexible diamond abrasive disc. The flexible diamond abrasive disc comprises a flexible substrate and a polishing working layer adhering to the substrate and is characterized in that the working layer is composed of, by weight, 35-38 parts of phenolic resin powder, 8-12 parts of melamine powder, 13-15 parts of copper powder, 8-10 parts of diamond, 9-12 parts of oxide abrasive material, 4-5 parts of carbide abrasive material, 2-3 pars of release agent and 4-5 parts of plant fibers. The granular diameters of the oxide abrasive materials and the carbide abrasive materials are smaller than the granular diameter of the diamond. The flexible diamond abrasive disc can effectively improve the polishing speed and simplify the polishing technology.

Description

technical field [0001] The invention relates to a diamond soft grinding plate and its preparation and grinding and polishing process. Background technique [0002] As is known, the diamond soft grinding disc is composed of a flexible base material and a grinding and polishing working layer attached to the base material. The grinding and polishing working layer is mainly made of a combination of diamond and resin materials. Buckled on the joint of the grinding machine, it is used for grinding and polishing. It can process special-shaped materials such as stone, ceramics, and floor tiles. It is suitable for stone polishing, line chamfering, arc-shaped plates and special-shaped stone processing. It has strong grinding force and durability. It is an ideal stone grinding tool with good performance, good softness, clarity and gloss. The whole grinding and polishing process is divided into four stages: coarse grinding, fine grinding, fine grinding and polishing. Taking stone surfac...

AI Technical Summary

Problems solved by technology

[0003] In addition, in order to achieve good chip removal and cooling effects, the surface of the working layer of the diamond soft grinding disc is usually provided with grid-like chip removal grooves. The depth of the existing chip removal grooves is usually 7 / 10-8 / 10 of the thickness of the working layer. , so that the whole working layer is often separated from the base material during the grinding and polishing process, which seriously affects the service life of the soft grinding disc and increases the processing cost

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