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Flexible diamond abrasive disc and manufacturing and polishing technology thereof

A technology for diamond and soft grinding discs, which is applied in the fields of diamond soft grinding discs and their preparation and grinding and polishing processes, can solve the problems of affecting the service life of the soft grinding discs, separating the working layer from the base material, and increasing the processing cost, so as to shorten the processing time and improve the Grinding and polishing efficiency and prolonging service life

Inactive Publication Date: 2014-04-09
QUANZHOU SHUANGYANG DIAMOND TOOL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, in order to achieve good chip removal and cooling effects, the surface of the working layer of the diamond soft grinding disc is usually provided with grid-like chip removal grooves. The depth of the existing chip removal grooves is usually 7 / 10-8 / 10 of the thickness of the working layer. , so that the whole working layer is often separated from the base material during the grinding and polishing process, which seriously affects the service life of the soft grinding disc and increases the processing cost

Method used

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  • Flexible diamond abrasive disc and manufacturing and polishing technology thereof
  • Flexible diamond abrasive disc and manufacturing and polishing technology thereof

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Embodiment 1

[0023] Embodiment 1: The working layer includes the following components by weight: 35 parts of phenolic resin powder, 12 parts of melamine powder, 13 parts of copper powder, 10 parts of diamond, 6 parts of aluminum oxide, 4 parts of tin oxide, 5 parts of tungsten carbide, 2 parts of zinc stearate and 5 parts of vegetable fiber.

Embodiment 2

[0024] Embodiment two: the working layer includes the following components by weight: 38 parts of phenolic resin powder, 8 parts of melamine powder, 15 parts of copper powder, 8 parts of diamond, 8 parts of aluminum oxide, 3 parts of tin oxide, 4 parts of tungsten carbide, 3 parts of zinc stearate and 4 parts of vegetable fiber.

[0025] As a soft grinding disc for rough machining, the particle size of diamond, aluminum oxide, tin oxide and tungsten carbide is 50-220 mesh.

[0026] As a soft grinding disc for fine processing, the particle size of diamond, aluminum oxide, tin oxide and tungsten carbide is 320-800 mesh.

[0027] As a finishing soft grinding disc, the particle size of diamond, aluminum oxide, tin oxide and tungsten carbide is 1000-3000 mesh.

[0028] As a soft grinding disc for polishing, the particle size of diamond, aluminum oxide, tin oxide and tungsten carbide is greater than 6000 mesh.

[0029] The preparation process of diamond soft abrasive discs include...

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Abstract

The invention relates to a flexible diamond abrasive disc and a manufacturing and polishing technology of the flexible diamond abrasive disc. The flexible diamond abrasive disc comprises a flexible substrate and a polishing working layer adhering to the substrate and is characterized in that the working layer is composed of, by weight, 35-38 parts of phenolic resin powder, 8-12 parts of melamine powder, 13-15 parts of copper powder, 8-10 parts of diamond, 9-12 parts of oxide abrasive material, 4-5 parts of carbide abrasive material, 2-3 pars of release agent and 4-5 parts of plant fibers. The granular diameters of the oxide abrasive materials and the carbide abrasive materials are smaller than the granular diameter of the diamond. The flexible diamond abrasive disc can effectively improve the polishing speed and simplify the polishing technology.

Description

technical field [0001] The invention relates to a diamond soft grinding plate and its preparation and grinding and polishing process. Background technique [0002] As is known, the diamond soft grinding disc is composed of a flexible base material and a grinding and polishing working layer attached to the base material. The grinding and polishing working layer is mainly made of a combination of diamond and resin materials. Buckled on the joint of the grinding machine, it is used for grinding and polishing. It can process special-shaped materials such as stone, ceramics, and floor tiles. It is suitable for stone polishing, line chamfering, arc-shaped plates and special-shaped stone processing. It has strong grinding force and durability. It is an ideal stone grinding tool with good performance, good softness, clarity and gloss. The whole grinding and polishing process is divided into four stages: coarse grinding, fine grinding, fine grinding and polishing. Taking stone surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D13/14B24D3/32B24D18/00C09K3/14
Inventor 陈秋平陈晓龙
Owner QUANZHOU SHUANGYANG DIAMOND TOOL
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