Reinforced foaming ceramic inorganic heat-preserving board and preparation method thereof
A technology of inorganic thermal insulation board and foamed ceramics, applied in the field of preparation of reinforced foamed ceramic inorganic thermal insulation board and thermal insulation board, can solve the problems of decreased thermal insulation performance, indoor condensation, cold and heat bridges, etc., and achieves light weight and increased surface area. The effect of roughness, material neatness
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Embodiment 1
[0021] The parts by weight of the raw materials are: nano-scale silica fume: 60 parts; cement: 5 parts; lime: 5 parts; gypsum: 3 parts; hydrogen peroxide: 0.3 parts; titanium reinforcement (titanium dioxide): 0.8 parts. These raw materials are mixed, and water with a mass of 30% of the total mass of the above-mentioned materials is added and mixed evenly. Lay a layer of fiber reinforcement layer (non-woven fabric or glass fiber mesh) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 20 minutes, then mold, release the mold, and put it at 220°C-280 The product is cured in an autoclave at ℃, pressure of 3.8MPa-4.2MPa, and relative humidity of 80%-100% for 6 hours.
[0022] Its thermal conductivity: 0.052W / m·k;
[0023] Compressive strength: 7.2MPa;
[0024] Density: 215kg / m 3 .
Embodiment 2
[0026] The weight parts of the raw materials of the board are: nano-scale silica fume: 90 parts; cement: 15 parts; lime: 8 parts; aluminum powder: 3.0 parts, titanium additive (titanium concentrate): 3.4 parts, mix these raw materials , And add water with a mass of 40% of the total mass of the above materials, stir and mix well. Lay a layer of fiber reinforcement layer (non-woven fabric or glass fiber mesh) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 60 minutes, and then mold, release the mold and put it at 220°C-280 The product is cured in an autoclave at ℃, pressure of 3.8MPa-4.2MPa, and relative humidity of 80%-100% for 8 hours.
[0027] Its thermal conductivity is 0.048W / m·k;
[0028] Compressive strength: 5.6MPa;
[0029] Density: 205kg / m 3 .
Embodiment 3
[0031] Parts by weight of the raw materials of the board: nano-scale silica fume: 120 parts; cement 30 parts; lime: 14 parts; foaming agent 1.0 part; boron-based reinforcement (borax): 2.5 parts, mix these raw materials and add the mass Stir and mix evenly with water that is 40% of the total mass of the above materials. Lay a layer of fiber reinforcement layer (non-woven fabric or glass fiber net) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 50 minutes, and then mold, release the mold, put it at 220°C-280 The product is cured in an autoclave at ℃, pressure of 3.8MPa-4.2MPa, and relative humidity of 80%-100% for 10 hours.
[0032] Its conductivity coefficient is 0.058W / m·k;
[0033] Compressive strength: 9MPa;
[0034] Density: 235kg / m 3 .
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