Reinforced foaming ceramic inorganic heat-preserving board and preparation method thereof
A technology for inorganic thermal insulation boards and foamed ceramics, which is applied in the field of preparation of reinforced foamed ceramic inorganic thermal insulation boards and thermal insulation boards. Small, not prone to cold and heat bridge effects
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Embodiment 1
[0021] The parts by weight of the raw materials are: nano-sized silica fume: 60 parts; cement: 5 parts; lime: 5 parts; gypsum: 3 parts; hydrogen peroxide: 0.3 parts; titanium-based reinforcement (titanium dioxide): 0.8 parts. Mix these raw materials, and add water whose mass is 30% of the total mass of the above-mentioned materials and stir to mix evenly. Lay a layer of fiber reinforced layer (non-woven fabric or glass fiber net) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 20 minutes, mold it, demould, put it into the mold at a temperature of 220°C-280°C ℃, pressure 3.8MPa-4.2MPa, and relative humidity 80%-100% in an autoclave for 6 hours to obtain the product.
[0022] Its thermal conductivity: 0.052W / m k;
[0023] Compressive strength: 7.2MPa;
[0024] Density: 215kg / m 3 .
Embodiment 2
[0026] The parts by weight of the raw materials of the board are: nano-scale microsilica: 90 parts; cement: 15 parts; lime: 8 parts; aluminum powder: 3.0 parts, titanium series additives (titanium concentrate): 3.4 parts, these raw materials are mixed , and add water whose quality is 40% of the total mass of the above materials and stir to mix evenly. Lay a layer of fiber reinforced layer (non-woven fabric or glass fiber net) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 60 minutes, then mold, demould, put in the temperature of 220°C-280°C ℃, pressure 3.8MPa-4.2MPa, and relative humidity 80%-100% in an autoclave for 8 hours to obtain the product.
[0027] Its thermal conductivity is 0.048W / m·k;
[0028] Compressive strength: 5.6MPa;
[0029] Density: 205kg / m 3 .
Embodiment 3
[0031] The parts by weight of raw materials for the board: nano-scale microsilica: 120 parts; cement 30 parts; lime: 14 parts; foaming agent 1.0 parts; boron-based reinforcement (borax): 2.5 parts The water that is 40% of the total mass of the above-mentioned materials is stirred and mixed evenly. Lay a layer of fiber reinforced layer (non-woven fabric or glass fiber mesh) in the mold, then inject the mixed material into the mold, foam at 20-35°C for 50 minutes, then mold, demould, put in the temperature of 220°C-280°C ℃, pressure 3.8MPa-4.2MPa, and relative humidity 80%-100% in an autoclave for 10 hours to obtain the product.
[0032] Its conductance coefficient is 0.058W / m·k;
[0033] Compressive strength: 9MPa;
[0034] Density: 235kg / m 3 .
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