Component having electrode dissolution prevention layer, and manufacturing method therefor
A manufacturing method and anti-layer technology, which can be used in printed circuit manufacturing, electrical components, manufacturing tools, etc., can solve the problems of damage to the reliability of the mounting substrate, reliability reduction, etc., and achieve the effect of preventing defects or disappearance
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Embodiment 1
[0291] As an example, prepare a substrate 10' in which a copper wiring pattern with a width W of 50 μm and a thickness of 20 μm is formed on a printed circuit board 1 with a length of 100 mm×a width of 100 mm (refer to e.g. image 3 (A)). Of the copper wiring patterns on the substrate 10', only the copper electrodes 2 having a width W of 50 µm as an electronic component mounting portion are mostly exposed, and the other copper wiring patterns are covered with an insulating layer.
[0292] As the first organic fatty acid-containing solution 3a preliminarily sprayed on the copper electrode 2, an organic fatty acid-containing solution containing 10% by mass of palmitic acid in ester-based synthetic oil free of metal salts such as nickel salts and cobalt salts and antioxidants was prepared. solution. The temperature of the first organic fatty acid-containing solution 3a was controlled at 150°C. The first molten solder 5a to be used was prepared as follows, that is, a 5-element l...
Embodiment 2
[0297] The component 10A obtained in Example 1 was dipped (immersed) in a solder tank filled with the second molten solder 16 at 250°C. As the second molten solder 16 , a ternary lead-free solder consisting of Ag: 3% by mass, Cu: 0.5% by mass, and Sn as the balance was used. The total time for the substrate to be dipped in the solder bath was 10 seconds. Table 1 shows the above production conditions and results, and Table 2 shows the evaluation results.
[0298] In this way, the substrate of Example 2 provided with the second solder layer 8 (component of the present invention) was obtained. When its cross-section is observed with an electron microscope, an electrode erosion prevention layer 4 with a thickness of about 1.5 μm without cracks is provided on a copper electrode 2 with a width W of 50 μm, and the electrode erosion prevention layer 4 is provided with a thickness T The second solder layer 8 is 20 μm.
[0299] The substrate to be obtained (for example, refer to Fi...
Embodiment 3
[0301] In Example 1, the content of palmitic acid contained in the first organic fatty acid-containing solution 3 a was set to 15% by mass, heated to 250° C., and sprayed toward the electrodes. In the process of removing the excess first molten solder 5a deposited on the copper electrode, the substrate 10 is placed in the vapor atmosphere of the second organic fatty acid solution 6b at 255°C, and in this atmosphere, it is heated by spraying from the spray nozzle 13. Nitrogen to 255°C (refer to Figure 4 (E)). The second organic fatty acid-containing solution 6b is used after making the same organic fatty acid-containing solution as the first organic fatty acid-containing solution 3a into a vapor at 255°C. As a result, obtained Figure 4 (F) The substrate 10B of the form shown. It should be noted that, in this substrate 10B, an electrode corrosion prevention layer 4 , a solder layer (a solder layer remaining after removal, not shown), and a coating film 6 are provided in thi...
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Abstract
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