Method for preparing nano-copper/epoxy resin composite material

A technology of epoxy resin and composite materials, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of low mechanical properties, poor dispersion, easy agglomeration of nano copper powder, etc. Good performance, improved mechanical properties and dimensional stability

Inactive Publication Date: 2014-04-16
HEILONGJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that existing nano-copper/epoxy resin composites have nano-copper powders that are easy to agglomerate and have poor disper

Method used

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  • Method for preparing nano-copper/epoxy resin composite material
  • Method for preparing nano-copper/epoxy resin composite material
  • Method for preparing nano-copper/epoxy resin composite material

Examples

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Example Embodiment

[0024] Embodiment 1: The present embodiment is a preparation method of nano-copper / epoxy resin composite material, which is completed according to the following steps:

[0025] 1. Preparation of nano-copper powder: ① Using distilled water as solvent at room temperature, the CuSO 4 ·5H 2 O dissolves completely to give CuSO 4 Aqueous solution; ② to the CuSO obtained in step 1 ① 4 Add polyvinylpyrrolidone to the aqueous solution, and sonicate for 30-50min to obtain polyvinylpyrrolidone / CuSO 4 mixed aqueous solution; 3. Mix hydrazine hydrate with distilled water at room temperature to obtain a hydrazine hydrate solution; 4. Use distilled water as a solvent at room temperature to completely dissolve NaOH to obtain a NaOH solution; CuSO 4 The mixed aqueous solution was added to the three-necked round-bottomed flask, then the hydrazine hydrate solution obtained in step 1 (3) was added to the three-necked round-bottomed flask, and the NaOH solution obtained in step 1 (4) was added...

Example Embodiment

[0041] Embodiment 2: The difference between this embodiment and Embodiment 1 is: the CuSO described in step 1 ① 4 ·5H 2 The mass ratio of O to distilled water is (0.15g~0.2g):1mL. Other steps are the same as in the first embodiment.

Example Embodiment

[0042] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the quality of the polyvinylpyrrolidone described in step 1 ② is the same as that of CuSO 4 The volume ratio of the aqueous solution is (0.015g~0.025g):1mL. Other steps are the same as in the first or second embodiment.

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Abstract

The invention provides a method for preparing a nano-copper/epoxy resin composite material, relates to a preparation method of an epoxy resin composite material, and aims to solve the problem that nano-copper powder in an existing nano-copper/epoxy resin composite material is easy to cluster, and the dispersibility in the epoxy resin is poor, so that a mechanical property of the nano-copper/epoxy resin composite material is poor. The method comprises the following steps: 1, preparing nano-copper powder; 2, dispersing; 3, preparing a composite material. The nano-copper/epoxy resin composite material prepared by the method has the advantages that: 1, the copper powder in the nano-copper/epoxy resin composite material is nanoscale; 2, the oxidation of the nano-copper powder is effectively prevented; 3, an emulsifying machine is used to disperse a nano-copper/epoxy resin system, the method is simple, and the dispersibility is good; 4, the nano-copper/epoxy resin composite material prepared by the invention has the characteristics that the tensile strength is 38-50 MPa, the elastic modulus is 1200-1700 MPa and the hardness is 80-84 degrees. The method can be used to prepare the nano-copper/epoxy resin composite material.

Description

technical field [0001] The invention relates to a preparation method of epoxy resin composite material. Background technique [0002] As a typical representative of thermosetting resin, epoxy resin has many outstanding properties, such as excellent mechanical properties, good electrical insulation properties, low shrinkage, good bonding performance, chemical resistance, good processing performance, low price, etc. These It is widely used in coatings, adhesives, electronic instruments, aerospace and other fields. However, the cross-linking density of epoxy resin after curing is large, showing a three-dimensional network structure, and there are disadvantages such as brittleness, poor impact resistance, poor fatigue resistance and heat resistance, and large internal stress, which largely limits its application. The epoxy resin / inorganic nanocomposite material is the most dynamic among the new materials nowadays. It can effectively combine some excellent properties of nanopar...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/08C08G59/44B29B7/00B29C35/02B22F9/24B82Y40/00B82Y30/00
Inventor 赵东宇闫飞韩春华付敬雯王琳张锡文
Owner HEILONGJIANG UNIV
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