Soldering flux for improving corrosion inhibition

Abstract

The invention discloses soldering flux for improving corrosion inhibition. The soldering flux comprises, by weight, 2%-4% of activating agent, 3%-5% of cosolvent, 3%-5% of surface active agent, 0.2%-0.3% of film-forming agent, 0.06%-0.10% of corrosion inhibitor, 0.5%-2% of antibacterial agent and the balance water. By mass, the corrosion inhibitor is a mixture formed by compounding benzimidazole (BIA) and benzotriazole (BTA) by the mass ratio of 1:1, the activating agent is a mixture of succinic acid and DL-malic acid by the mass ratio of 1:1, the surface active agent is isomerism tridecane alcohol ethoxylate, the cosolvent is a mixture of compounding ethanediol, isopropanol and butyl cellosolve by the mass ratio of 1:1:1, the film-forming agent is polyethylene glycol-6000, the antibacterial agent is triclosan, and all the chemicals are chemically pure. Through the mode, the soldering flux for improving corrosion inhibition is high in corrosion inhibition and has the advantages of low toxicity, environmental protection and the antibacterial effect.

Description

technical field [0001] The invention relates to the field of flux, in particular to a flux with improved corrosion inhibition performance. Background technique [0002] The development of environmentally friendly no-clean flux is an inevitable requirement for the future electronics industry to realize "green" manufacturing technology. No-clean flux has many components, mainly including activators, solvents, surfactants, film formers, corrosion inhibitors, antioxidants and other additives, among which there are many research reports on activators and their working principles. As a common activator, organic acid releases H+ during the soldering process, removes the oxide film on the substrate surface, reduces the surface tension during soldering, increases the wettability of the solder and pad metal, and improves solderability. If the amount of organic acid is too much or the acidity is strong, it will cause corrosion to the base metal material and solder, which will cause sh...

AI Technical Summary

Problems solved by technology

BTA is a high-efficiency corrosion inhibitor for copper. Although its corrosion inhibition efficiency is high, its toxicity is also relatively high (rat oral half-lethal dose is 500 mg / kg), which poses great harm to operators and the environment.