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Bisphenol A epoxy resin composition modified by polyurethane structure and its preparation and application

A technology of epoxy resin and polyurethane, which is applied in the direction of textiles and papermaking, fiber treatment, fiber type, etc., can solve the problems of lack of fiber opening and expansion performance, restriction of sizing agent engineering application, poor clustering and wear resistance, etc. Achieve the effects of improving process permeability, improving clustering and wear resistance, and realizing industrial production

Active Publication Date: 2016-09-14
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, judging from the current application status, when the sizing agent prepared by using the above resin formula is applied to carbon fiber and graphite fiber, it has poor bundling and abrasion resistance under the condition of normal fiber sizing amount (<1.40%), and poor fiber opening and expansion properties. Problems such as lack of web performance and insufficient resilience toughness, especially in the engineering application of carbon fibers with 12K and above tow numbers, restrict the actual engineering application of the above-mentioned sizing agents

Method used

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  • Bisphenol A epoxy resin composition modified by polyurethane structure and its preparation and application
  • Bisphenol A epoxy resin composition modified by polyurethane structure and its preparation and application
  • Bisphenol A epoxy resin composition modified by polyurethane structure and its preparation and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-12

[0024] Put the quantitative epoxy resin mixture in a 250ml four-neck flask with a mechanical stirring device, heat to 110°C, control the vacuum pressure at 100-0.1mmHg, and vacuum dehydrate for 2 hours until no bubbles are generated. Cool down to 70°C, remove the vacuum device, and insert a condenser tube. Under the protection of high-purity nitrogen, a quantitative amount of hexamethylene diisocyanate (HDI) was slowly added dropwise into the flask with a micro metering pump. After the dropwise addition, it was reacted at 70°C for 1 hour, and then the temperature was raised to 95°C. ℃ for more than 2 hours, sampling for infrared analysis, when the result shows that there is no -NCO group, a polyurethane structure-modified bisphenol A epoxy resin composition is prepared. The type and amount of epoxy resin mixture used, and the amount of hexamethylene diisocyanate (HDI) are shown in Table 1.

[0025] Table 1, raw material quality table for reaction

[0026]

[0027]

Embodiment 13-24

[0029] Put the quantitative epoxy resin mixture in a 250ml four-neck flask with a mechanical stirring device, heat to 110°C, control the vacuum pressure at 100-0.1mmHg, and vacuum dehydrate for 2 hours until no bubbles are generated. Cool down to 70°C, remove the vacuum device, and insert a condenser tube. Under the protection of high-purity nitrogen, a quantitative amount of isophorone diisocyanate (IPDI) was slowly added dropwise to the flask with a micro metering pump. After the dropwise addition, it was reacted at 70°C for 1 hour, and then heated to 95°C After reacting for more than 2 hours, samples were taken for infrared analysis, and when the results showed that there was no -NCO group, a polyurethane structure-modified bisphenol A epoxy resin composition was prepared. The type and amount of epoxy resin mixture used, and the amount of isophorone diisocyanate (IPDI) are shown in Table 2.

[0030] Table 2, raw material quality table for reaction

[0031]

Embodiment 25-36

[0033] Put the quantitative epoxy resin mixture in a 250ml four-neck flask with a mechanical stirring device, heat to 110°C, control the vacuum pressure at 100-0.1mmHg, and vacuum dehydrate for 2 hours until no bubbles are generated. Cool down to 50°C, remove the vacuum device, and insert a condenser tube. Under the protection of high-purity nitrogen, a quantitative amount of diphenylmethane diisocyanate (MDI) was slowly added dropwise into the flask with a micrometering pump. After the dropwise addition, it was reacted at 50°C for 1 hour, and then heated to 85°C. After reacting for more than 2 hours, samples were taken for infrared analysis, and when the results showed that there was no -NCO group, a polyurethane structure-modified bisphenol A epoxy resin composition was prepared. The type and amount of epoxy resin mixture used, and the amount of diphenylmethane diisocyanate (MDI) are shown in Table 3.

[0034] Table 3, raw material quality table for reaction

[0035]

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Abstract

The invention relates to a polyurethane structure-modified epoxy resin sizing agent emulsion, which comprises 55-78wt% of polyurethane structure-modified epoxy resin composition, 20-40wt% of surfactant, 0.5-2wt% of anti-oxidant, 1-2wt% of levelling agent and 0.5-1wt% of antifreezing agent. A preparation method comprises the following steps: pumping bisphenol A epoxy resin under vacuum and dehydrating until the bubbles does not generate, cooling and adding isocyanate to prepare the epoxy resin composition; mixing and homogenizing the surfactant and anti-oxidant according to the above material fraction, and then gradually adding deionized water, the levelling agent and the antifreezing agent to obtain the product. The carbon fiber prepared by polyurethane structure-modified epoxy resin sizing agent emulsion has good convergence, wear resistance and toughness, the convergence and wear resistance are easily and freely adjusted through the amount of an isocyanate component; a sizing agent and on-site secondary mixing are not required at anaphase for the carbon fiber sizing agent, the application and stability are good, the carbon fiber sizing wellability is good, and the polyurethane structure-modified bisphenol A epoxy resin composition is benefit for industrial stabilization production of carbon fiber.

Description

technical field [0001] The invention belongs to the field of modification and preparation of epoxy resin in organic polymer materials, and in particular relates to a bisphenol A epoxy resin composition modified by polyurethane structure and its preparation and application. Background technique [0002] Epoxy resin has the advantages of high strength, excellent bonding performance, chemical stability, easy processing and low cost, and its polymer composite materials are widely used in many industrial fields. However, due to the high cross-linking density of pure epoxy resin after curing, there are disadvantages such as large internal stress, brittle cured material, and poor heat resistance, which limit its application in fiber-reinforced composite materials. The interface layer plays an important role in the composite material. It is the transition layer connecting the reinforcement and the matrix, and it is also a bridge for transferring stress, so its structure and performa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/58D06M15/564D06M101/40
CPCC08G18/3215C08G18/58D06M15/564D06M2101/40D06M2200/40
Inventor 季春晓刘瑞超黄翔宇姚军蔡炜李松华李鹏毕建东唐志强
Owner CHINA PETROLEUM & CHEM CORP
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