Curable composition for sealing optical semiconductor and optical semiconductor device using the same

A curable composition and optical semiconductor technology, applied in semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., can solve the problem of insufficient adhesion of polyphthalamide and broken die bonding wire Insufficient impact resistance of opening and sealing materials, etc., to achieve good adhesion, not easy to peel off, and improve yield and productivity
CN103804880AActive Publication Date: 2014-05-21SHIN ETSU CHEM IND CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHIN ETSU CHEM IND CO LTD
Publication Date
2014-05-21

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Abstract

The invention provides a curable composition for a sealing optical semiconductor, which can form cured products with high impact resistance and adhesion properties, and an optical semiconductor device having optical semiconductor elements sealed by the cured products formed by the curable composition for the sealing optical semiconductor. The curable composition for the sealing optical semiconductor is characterized by containing a (A) linear chain fluoro polymer, a (B) fluorine-containing organic hydrogenated siloxane with an SiH group and a fluorine-containing organic group, a (C) platinum group metal catalyst, an (D) annular organic siloxane with an SiH group, a fluorine-containing organic group, and an epoxy group, the hardness of the cured products through the curing measured by an A type sclerometer regulated by JIS K6253-3 is in the range of 30-80.
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Description

technical field

[0001] The present invention relates to a curable composition for optical semiconductor sealing and an optical semiconductor device using the same. Background technique

[0002] At present, as a curable composition, a straight-chain fluoropolyether compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure on the main chain, and at least two or more alkenyl groups in one molecule are disclosed. A composition composed of a fluorine-containing organohydridosiloxane with a hydrogen atom bonded to a silicon atom and a platinum group compound to obtain heat resistance, chemical resistance, solvent resistance, mold release, water repellency, and oil repellency A cured product with an excellent balance of properties such as low-temperature properties and low-temperature properties (Patent Document 1).

[0003] Moreover, it is disclosed that by adding an organopolysiloxane having a hydrosilyl group and an epoxy group and / or a tria...

Claims

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