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Curable composition for sealing optical semiconductor and optical semiconductor device using the same

A curable composition and optical semiconductor technology, applied in semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., can solve the problem of insufficient adhesion of polyphthalamide and broken die bonding wire Insufficient impact resistance of opening and sealing materials, etc., to achieve good adhesion, not easy to peel off, and improve yield and productivity

Active Publication Date: 2014-05-21
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, among the cured products obtained by curing the compositions actually prepared in the prior art, low-hardness cured products having a Type A Shore hardness of about 20 specified in JIS K6253-3 are used as light-emitting diodes (hereinafter, Unless otherwise specified, it is called "LED") sealing material, and the impact resistance of the sealing material may not be sufficient
For example, when arranging assembled (barazumi) optical semiconductor devices with LEDs sealed with the cured product in a certain direction and posture using a bowl-shaped vibrating feeder, die bonding that connects LED chips and electrodes often occurs The problem that the wire is disconnected due to the impact caused by the collision between the optical semiconductor devices
[0010] On the other hand, when the above-mentioned hardness of the cured product is excessively increased in order to improve the above-mentioned impact resistance, adhesion of the cured product to LED packaging materials, especially polyphthalamide (PPA), which is a representative material, occurs. The problem that connectivity becomes insufficient

Method used

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  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same
  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same
  • Curable composition for sealing optical semiconductor and optical semiconductor device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0271] To 100 parts by mass of a linear fluoropolymer represented by the following formula (23) (viscosity 4,310 mPa·s, vinyl content 0.0909 mol / 100 g), sequentially add platinum-divinyltetramethyldisiloxane complex 0.15 parts by mass of a toluene solution (platinum concentration: 0.5% by mass), 0.20 parts by mass of a 60% toluene solution of 1-ethynyl-1-hydroxycyclohexane, a fluorine-containing organosilane represented by the following formula (24): 17.8 parts by mass of an alkane (0.00486 mol / g of SiH groups) and 3.0 parts by mass of a cyclic organopolysiloxane represented by the following formula (25) were uniformly mixed, and then a defoaming operation was performed to prepare a composition.

[0272] [chemical formula 44]

[0273]

Embodiment 2

[0275] In the above-mentioned Example 1, the straight-chain fluoropolymer represented by the above-mentioned formula (23) was changed to a straight-chain fluoropolymer represented by the following formula (26) (viscosity 4,250 mPa·s, vinyl content 0.0911 A composition was prepared in the same manner as in Example 1 except that mol / 100 g) was 100 parts by mass.

[0276] [chemical formula 45]

[0277]

Embodiment 3

[0279] In the above-mentioned Example 1, the straight-chain fluoropolymer represented by the above-mentioned formula (23) was changed to a straight-chain fluoropolymer represented by the following formula (27) (viscosity 17,800 mPa·s, vinyl content 0.0290 mol / 100g) 100 parts by mass, and the addition amount of the fluorine-containing organohydridosiloxane represented by the above formula (24) was changed to 5.67 parts by mass, and a composition was prepared in the same manner as in Example 1.

[0280] [chemical formula 46]

[0281]

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PUM

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Abstract

The invention provides a curable composition for a sealing optical semiconductor, which can form cured products with high impact resistance and adhesion properties, and an optical semiconductor device having optical semiconductor elements sealed by the cured products formed by the curable composition for the sealing optical semiconductor. The curable composition for the sealing optical semiconductor is characterized by containing a (A) linear chain fluoro polymer, a (B) fluorine-containing organic hydrogenated siloxane with an SiH group and a fluorine-containing organic group, a (C) platinum group metal catalyst, an (D) annular organic siloxane with an SiH group, a fluorine-containing organic group, and an epoxy group, the hardness of the cured products through the curing measured by an A type sclerometer regulated by JIS K6253-3 is in the range of 30-80.

Description

technical field [0001] The present invention relates to a curable composition for optical semiconductor sealing and an optical semiconductor device using the same. Background technique [0002] At present, as a curable composition, a straight-chain fluoropolyether compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure on the main chain, and at least two or more alkenyl groups in one molecule are disclosed. A composition composed of a fluorine-containing organohydridosiloxane with a hydrogen atom bonded to a silicon atom and a platinum group compound to obtain heat resistance, chemical resistance, solvent resistance, mold release, water repellency, and oil repellency A cured product with an excellent balance of properties such as low-temperature properties and low-temperature properties (Patent Document 1). [0003] Moreover, it is disclosed that by adding an organopolysiloxane having a hydrosilyl group and an epoxy group and / or a tria...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/00C08L83/08H01L33/56
CPCH01L2224/45144H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/49107H01L2924/00014H01L2924/00C08G77/385C08G77/46C08L83/08C08L83/12H01L23/29
Inventor 越川英纪小池则之
Owner SHIN ETSU CHEM IND CO LTD
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