Method for metallizing flexible PET-base ITO conductive layer and application of method
A conductive layer and metallization technology, which is applied in the field of chemical plating, can solve the problems of large differences in key groups on the surface and the inability to apply metallization on the conductive surface of conductive PET plastics, etc., to achieve clear wiring, wide fluctuation range of process parameters, and no overlap. The effect of line bridging
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0041] Implementation example of the present invention The specific implementation steps are: solvent degreasing—water washing—alkaline degreasing—water washing—alkaline etching—water washing—acid activation—water washing—precatalysis—water washing—catalysis—water washing—reduction—water washing—electroless nickel plating .
[0042] All formulas in the implementation examples of the present invention are configured according to mass percentage.
[0043] Specific implementation examples one to eight refer to the attached Figure 3 to Figure 10 .
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com