Photosensitive resin composition and insulating layer manufactured from the same

A technology of photosensitive resin and composition, applied in the field of insulating layer and photosensitive resin composition, which can solve the problems of film diffusion, reduction of total film residual ratio, pattern damage, etc., achieve fast sensitivity, ensure post-processing stability, and be easy Processing effect

Inactive Publication Date: 2014-07-09
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the sensitivity can be improved by increasing the solubility of the alkaline developer in the polymer used for the organic insulating film or prolonging the developing time, this method has limitations and can cause the non-exposed part to dissolve along with the exposed part, resulting in a total film residue lower than
This result leads to problems of film diffusion and pattern damage in substrates for large displays

Method used

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  • Photosensitive resin composition and insulating layer manufactured from the same
  • Photosensitive resin composition and insulating layer manufactured from the same
  • Photosensitive resin composition and insulating layer manufactured from the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5 and comparative example 1 to 6

[0128] Roll printing ink compositions were prepared by using the ingredients listed in Table 1 in their respective contents (% by weight).

[0129] [Table 1]

[0130]

[0131]

[0132] Example

[0133] Regarding the resin compositions prepared according to Examples and Comparative Examples, the following evaluation experiments were conducted and the results thereof are shown in Table 2 below.

[0134] (1) Sensitivity

[0135] Each photosensitive resin composition according to Examples and Comparative Examples was applied onto a glass substrate (Corning 1737, manufactured by Corning co.) having a thickness of 0.7 mm, followed by heating it on a hot plate at 100° C. for 125 seconds to The solvent was volatilized, thereby forming a photosensitive resin composition layer having a thickness of 4.0 μm.

[0136] Thereafter, in order to obtain a contact hole pattern having a diameter of 10 μm, by using a mask having a square pattern opening with a size of 10 μm and by means...

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PUM

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Abstract

The present invention discloses a photosensitive resin composition and an insulating layer manufactured from the same, wherein the photosensitive resin composition obtains quick sensitivity and high transmittance by including a non-sulfamide photoacid generator and a photosensitizer.

Description

technical field [0001] The present invention relates to a photosensitive resin composition having rapid sensitivity and high transmittance and an insulating layer prepared using the same. Background technique [0002] Regarding displays such as thin-film transistor (TFT) liquid crystal displays, inorganic protective layers such as silicon nitride have generally been used as protective films for protecting and insulating TFT circuits, however, this has involved problems caused by their high dielectric constant Improvement of the aperture ratio is difficult. In order to overcome the above-mentioned problems, there is instead an increasing demand for an organic insulating film having a low dielectric constant. [0003] As for such an organic insulating film as described above, a photosensitive resin formed of a high-molecular compound that undergoes a chemical reaction upon exposure to light or electron beams to have a different solubility to a specific solvent is generally us...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/09
CPCY02P20/582G02F1/13G03F7/028G03F7/11
Inventor 朴汉雨任玟柱成始震
Owner DONGWOO FINE CHEM CO LTD
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