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Printed circuit board scrap nonmetal powder baking-free brick and making method thereof

A non-metallic powder and waste printing technology, which is applied in the field of renewable resource recycling technology and building materials, can solve the problems of waste of land resources and energy consumption, and achieve the effects of environmental protection, no pollution, and reduced energy consumption

Active Publication Date: 2014-07-30
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the above-mentioned prior art, the object of the present invention is to provide a non-metallic powder burn-free brick of waste printed circuit boards and a preparation method thereof. Potential resource attributes, reasonable disposal of substances with potential environmental risks, and effective solution to the waste of land resources and energy consumption caused by sintered clay bricks, has good economic and social significance

Method used

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  • Printed circuit board scrap nonmetal powder baking-free brick and making method thereof
  • Printed circuit board scrap nonmetal powder baking-free brick and making method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] The types of raw materials and processing aids used in this embodiment and the implementation process are consistent with the above-mentioned five-step process. The difference is that there is no need to prepare an additive solution in step 3 of this embodiment, but directly add water to the mixed dry material at a weight ratio of 8% and stir evenly. In addition, the difference is that the material ratio of this embodiment is as follows:

[0031]

Embodiment 2

[0033] The raw materials used in this embodiment and the type of processing aid and the implementation process are consistent with the above-mentioned five-step process, the difference is that:

[0034] The proportioning of materials in the step 2 is non-metallic powder 30%wt, cement 20wt%, sand 40wt%, lime 5wt%, gypsum 5wt%;

[0035] In step 3, the admixture solution consists of 5wt% Na 2 SO 4 and 4wt% calcium lignosulfonate, and the admixture solution is added in the mixed material in a ratio of 10wt%;

[0036] The humidity in the curing environment for the first 7 days in step 5 is 80%, and the temperature is 25°C.

[0037] The compressive strength, flexural strength and other properties of the waste printed circuit board non-metal powder non-burning brick products prepared in the above examples are tested, and it is known that the prepared non-burning product has a compact structure and excellent performance, which meets the requirements of the national construction indu...

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Abstract

The invention relates to a making method of a printed circuit board scrap nonmetal powder baking-free brick. The method comprises the following steps: mechanically crushing printed circuit board scraps, separating metals in the scraps, and screening residual nonmetal powder for later use; uniformly mixing the prepared nonmetal powder with cement, sand, lime and gypsum according to a certain weight ratio to prepare a mixture; dissolving Na2SO4 and calcium lignin sulphonate in water to prepare an additive solution, adding the additive solution to the mixture prepared in step 2, and uniformly stirring for hydration; putting the hydrated material in a brick press, and carrying out press molding to make baking-free semi-finished brick products; and maintaining the baking-free semi-finished brick products to make baking-free brick products. The method is used for making baking-free brick products by using printed circuit board scrap nonmetal powder, fully utilizes the latent resource attributes of the nonmetal powder, reasonably processes substances having potential environment risks, effectively solves the land resource and energy waste problems caused by clay brick sintering, and has good economic and social benefits.

Description

technical field [0001] The present invention mainly relates to the technical fields of recycled resource recycling technology and building materials, and in particular to non-metal powder burn-free bricks of waste printed circuit boards and a preparation method thereof. Background technique [0002] After the waste printed circuit boards produced during the dismantling process of waste electrical and electronic products are mechanically processed to recover the metal components, the remaining non-metallic powders are randomly piled up in the open air due to the high cost of recycling and immature processing technology. Pollutants such as flame retardants and heavy metals may enter the surrounding atmosphere, water and soil through volatilization or leaching, threatening the safety of the ecological environment and human health. [0003] Unburned bricks use one or several of the raw materials such as fly ash, coal gangue, tailings slag, chemical slag or natural sand, sea mud ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/04C04B28/06C04B28/32C04B18/04
CPCY02W30/91
Inventor 李金惠只艳董庆银刘丽丽申冰玉
Owner TSINGHUA UNIV
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