Anisotropic conductive film

An anisotropic, conductive connection technology, applied in the direction of conductive adhesive connection, conductive coating, conductive layer on the insulating carrier, etc., can solve the problems of reduced storage stability and connection reliability, and achieve excellent connection reliability Effect
CN103996431AActive Publication Date: 2014-08-20DEXERIALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
DEXERIALS CORP
Publication Date
2014-08-20

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Abstract

The invention discloses an anisotropic conductive film, a connection method and a coalition, comprising a conductive particle layer which comprises conductive electric particles, film forming resin, solidified resin and a curing agent, and an insulation adhesive layer comprising the film forming resin, solidified resin and a curing agent. Only the insulation adhesive layer contains the thiol compounds, and the surface of the conductive particle has Cu.
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Description

technical field

[0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique

[0002] At present, as a means of connecting electronic parts and substrates, a strip-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film) coated with a thermosetting resin dispersed with conductive particles on a release film is used. ).

[0003] The anisotropic conductive film is used, for example, to connect terminals of a flexible printed circuit board (FPC) and an IC (Integrated Circuit) chip to electrodes formed on a glass substrate of an LCD (Liquid Crystal Display) panel. This is a case where the terminals are electrically connected while bonding.

[0004] The anisotropic conductive connection for electrically connecting the terminal of the substrate and the terminal of the electronic component using the above-mentioned anisotropic conductive film is usually performed ...

Claims

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