Anisotropic conductive film

An anisotropic, conductive connection technology, applied in the direction of conductive adhesive connection, conductive coating, conductive layer on the insulating carrier, etc., can solve the problems of reduced storage stability and connection reliability, and achieve excellent connection reliability Effect

Active Publication Date: 2014-08-20
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the proposed technology, there is a problem that the connection reliability is lowered if the connection is performed at such a lower temperature.
[0007] In addition, an anisotropic conductive film containing a thiol compound generally has a problem of reduced storage stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0133]

[0134] -Formation of conductive particle-containing layer-

[0135] 40 parts by mass of phenoxy resin (trade name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), bifunctional acrylic monomer (polyethylene glycol) Alcohol #200 diacrylate, brand name: A-200, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 30 parts by mass, urethane acrylate (trade name: U-2PPA, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 20 parts by mass, Phosphate-type acrylate (trade name: PM-2, manufactured by Nippon Kayaku Co., Ltd.) 2 parts by mass, organic peroxide (dilauroyl peroxide) 3 parts by mass, and conductive particles (Cu particles, average particle diameter 5 μm ) 5 parts by mass are uniformly mixed. The mixed complex was coated on silicone-treated PET (polyethylene terephthalate) in such a way that the average thickness after drying was 17 μm, and dried at 70°C for 5 minutes to produce a conductive Sexual particle layer.

[0136] -Production of in...

Embodiment 2～20、 and comparative example 1～5

[0164] In Example 1, except for the type and content of the conductive particles in the conductive particle-containing layer (A layer), the type and content of the thiol compound in the conductive particle-containing layer, and the insulating adhesive layer (N layer) ) and the type and content of the thiol compound, and the type of organic peroxide in the conductive particle-containing layer and the insulating adhesive layer were changed to the conductive particles in the conductive particle-containing layer shown in Table 1 to Table 3 The type and content of the thiol compound in the conductive particle-containing layer, the type and content of the thiol compound in the insulating adhesive layer, and the organic compound in the conductive particle-containing layer and the insulating adhesive layer. Except the kind of peroxide, it carried out similarly to Example 1, and obtained the anisotropic conductive film.

[0165] Using the obtained anisotropic conductive film, it produc...

Embodiment 20

[0174] The "resin particles" in Example 20 are copper-plated resin particles obtained by performing electroless copper plating on benzoguanamine resin particles with an average particle diameter of 4.8 μm.

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Abstract

The invention discloses an anisotropic conductive film, a connection method and a coalition, comprising a conductive particle layer which comprises conductive electric particles, film forming resin, solidified resin and a curing agent, and an insulation adhesive layer comprising the film forming resin, solidified resin and a curing agent. Only the insulation adhesive layer contains the thiol compounds, and the surface of the conductive particle has Cu.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] At present, as a means of connecting electronic parts and substrates, a strip-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film) coated with a thermosetting resin dispersed with conductive particles on a release film is used. ). [0003] The anisotropic conductive film is used, for example, to connect terminals of a flexible printed circuit board (FPC) and an IC (Integrated Circuit) chip to electrodes formed on a glass substrate of an LCD (Liquid Crystal Display) panel. This is a case where the terminals are electrically connected while bonding. [0004] The anisotropic conductive connection for electrically connecting the terminal of the substrate and the terminal of the electronic component using the above-mentioned anisotropic conductive film is usually performed ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01R4/04C09D171/00C09D4/02C09D171/12C09D5/24C09J171/00C09J4/02C09J171/12C09J11/06
CPCC09J5/06C09J11/06C09J201/00C09J7/20H01B5/14
Inventor 田卷刚志
Owner DEXERIALS CORP
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