Spatial modulation spectrometer based on grid beam splitter and manufacturing method
A space modulation and production method technology, applied in the direction of interference spectroscopy, color/spectral characteristic measurement, instruments, etc., can solve the problems of unfavorable real-time performance and online measurement, large volume, heavy weight, expensive operation and maintenance costs, etc., and achieve light weight , Small size, simple structure
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specific Embodiment approach 1
[0023] Specific implementation mode 1. Combination Figure 1 to Figure 3 Describe this embodiment, the spatial modulation spectrometer based on the grid beam splitter, the system structure consists of an infrared light source 1, a collimation system 2, a sample cell 3, a beam reduction system 5, an infrared CCD 5, a grid beam splitter 7, multiple It consists of a step-by-step micro-mirror 9 and a multi-step micro-mirror 8. The light emitted by the infrared light source 1 is collimated into infrared parallel light after being passed through the collimation system 2. After the infrared parallel light is absorbed by the sample in the sample cell 3, it is then The coherent two beams are split by the grid-type beam splitter 7 . A beam of light is incident on the multi-level large step micro-mirror 9 , and returns to the grid-type beam splitter 7 after being reflected by the multi-level large step mirror 7 . Two other beams of light are incident on the multi-level small step micro-...
specific Embodiment approach 2
[0028] Specific embodiment two, combine Figure 4 to Figure 6 This embodiment is described. This embodiment is the manufacturing method of the spatially modulated spectrometer based on the grating beam splitter described in the first embodiment. The method is implemented by the following steps:
[0029] a. Make the base of the attenuator system, select the base material to make the base, the material can be aluminum or copper or titanium or stainless steel or silicon etc. The base material is manufactured according to the size requirements of the design, and the upper surface is polished; the roughness of the polished surface is less than or equal to 10 microns, and the flatness is less than or equal to 50 microns.
[0030] b. If Figure 4 As shown, the reference lines perpendicular to each other are made on the polished substrate by precision machining method or MOEMS-based photolithography and etching method as the first optical axis reference line 10 and the second optical...
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