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Epoxy resin composition, semi-hardened epoxy resin composition, hardened epoxy resin composition, resin sheet, prepreg, laminate sheet, metal substrate, wiring board, method for producing semi-hardened epoxy resin composition, and method for producing

A technology of resin composition and resin sheet, which is applied in the field of resin composition, can solve problems such as low thermal conductivity and hinder heat dissipation, and achieve the effect of excellent thermal conductivity

Inactive Publication Date: 2014-09-03
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in general, cured resins have low thermal conductivity, which is a major factor hindering heat dissipation, so it is desired to develop cured resins with high thermal conductivity.

Method used

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  • Epoxy resin composition, semi-hardened epoxy resin composition, hardened epoxy resin composition, resin sheet, prepreg, laminate sheet, metal substrate, wiring board, method for producing semi-hardened epoxy resin composition, and method for producing
  • Epoxy resin composition, semi-hardened epoxy resin composition, hardened epoxy resin composition, resin sheet, prepreg, laminate sheet, metal substrate, wiring board, method for producing semi-hardened epoxy resin composition, and method for producing
  • Epoxy resin composition, semi-hardened epoxy resin composition, hardened epoxy resin composition, resin sheet, prepreg, laminate sheet, metal substrate, wiring board, method for producing semi-hardened epoxy resin composition, and method for producing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0414]

[0415] 0.45% by mass of the first filler (α-alumina, HIT-70), 70.29% by mass of the second filler (boron nitride, HP-40), 10.22% by mass of the thermosetting resin (resin A), 6.30% by mass of the curing agent (CRN) % by mass, 0.11% by mass of curing accelerator (TPP), 0.07% by mass of silane coupling agent (KBM-573), and 12.56% by mass of solvent (CHN) were mixed to obtain an epoxy resin varnish as a resin composition containing a solvent .

[0416] Set the density of alumina to 3.97g / cm 3 , The density of boron nitride is set to 2.18g / cm 3 , and the density of the mixture of resin A and CRN is set to 1.20g / cm 3 , the ratio of the first filler to the total volume of the first filler, the second filler, the thermosetting resin and the curing agent was calculated, and the result was 0.26% by volume. In addition, the ratio of the second filler to the above-mentioned total volume was calculated, and it was 74% by volume.

[0417]

[0418] The above-produced epoxy ...

Embodiment 2

[0443] The first filler (α-alumina, HIT-70: a mixture of 0.45% by volume and AA-04: 11.76% by volume) 12.21% by mass, the second filler (boron nitride, HP-40) 58.53% by mass, thermosetting resin (Resin A) 10.22% by mass, curing agent (CRN) 6.30% by mass, curing accelerator (TPP) 0.11% by mass, silane coupling agent (KBM-573) 0.07% by mass, and solvent (CHN) 12.56% by mass were mixed, The epoxy resin varnish is obtained as a resin composition containing a solvent.

[0444] Set the density of alumina to 3.97g / cm 3 , The density of boron nitride is set to 2.18g / cm 3 , and the density of the mixture of resin A and CRN is set to 1.20g / cm 3 , the ratio of the first filler to the total volume of the first filler, the second filler, the thermosetting resin and the curing agent was calculated, and the result was 7.5% by volume. In addition, the ratio of the second filler to the above-mentioned total volume was calculated and found to be 65% by volume.

[0445] Except having used th...

Embodiment 3

[0448] The first filler (α-alumina, HIT-70) 0.45% by mass, the second filler 63.84% by mass (a mixture of aluminum nitride, FAN-f30: 49.02% by volume and FAN-f05: 14.82% by volume), the third Filler (aluminum nitride, ShapalH) 10.39% by mass, thermosetting resin (resin A) 7.23% by mass, curing agent (CRN) 4.46% by mass, curing accelerator (TPP) 0.08% by mass, silane coupling agent (KBM-573) 0.07% by mass and 13.48% by mass of the solvent (CHN) were mixed to obtain an epoxy resin varnish as a resin composition containing the solvent.

[0449] Set the density of alumina to 3.97g / cm 3 , The density of aluminum nitride is set to 3.26g / cm 3 , and the density of the mixture of resin A and CRN is set to 1.20g / cm 3 , the ratio of the first filler to the total volume of the first filler, the second filler, the thermosetting resin and the curing agent was calculated, and the result was 0.37% by volume. In addition, the ratio of the second filler to the above-mentioned total volume wa...

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Abstract

The present invention provides an epoxy resin composition including: an epoxy resin monomer represented by the following Formula (I); a hardening agent containing a novolak resin obtained from a divalent phenol compound; and an alumina filler containing-alumina. In the Formula (I), R1 to R4 each independently represent a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

Description

technical field [0001] The present invention relates to a resin composition, and a resin sheet, a prepreg, a laminate, a metal substrate, a printed wiring board, and a power semiconductor device using the resin composition. Background technique [0002] Most electronic and electrical equipment ranging from motors and generators to printed wiring boards and IC chips include conductors and insulating materials for conducting electricity. In recent years, the amount of heat generated has increased with the miniaturization of these devices, so how to dissipate heat from insulating materials has become an important issue. [0003] As insulating materials used in these devices, cured resins made of resin compositions are widely used from the viewpoint of insulation, heat resistance, and the like. However, generally, cured resins have low thermal conductivity, and this is a major factor that hinders heat dissipation. Therefore, development of cured resins with high thermal conduct...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/04C08G59/24C08G59/62C08K3/22
CPCC08G59/04C08G59/24C08K3/22C08G59/62C08L63/00C08L101/02C08K3/28C08K3/013C08K7/00C08J5/18C08J5/24H01B3/40H05K1/03C08K2003/2227
Inventor 吉田优香竹泽由高宫崎靖夫高桥裕之
Owner HITACHI CHEM CO LTD
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