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LED potting technique

A process and glue sealing technology, applied in the field of LED glue potting and packaging technology, can solve the problem of low heat dissipation efficiency, and achieve the effect of preventing chip work, good dredging effect, and delaying the thermal aging process.

Inactive Publication Date: 2014-09-24
江苏华程光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in order to overcome the problem of low heat dissipation efficiency in the LED potting and packaging process in the prior art, a LED potting and packaging process is provided, by using UV light-cured LED sealant containing nano-metal powder , the LED sealant has a good effect on heat conduction, which can effectively prevent the work of the chip from being affected by local overheating caused by the heat accumulation of the chip, and delay the thermal aging process of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A LED potting and encapsulating process, comprising the steps of:

[0029] (1) Take the LED sealant, stir for 3-5 minutes under dark conditions, and set aside;

[0030] (2) Inject the LED sealant into the molding cavity, then insert the pressure-welded LED bracket, and irradiate with ultraviolet light for 5-10 minutes to cure the LED sealant to obtain an LED semi-finished product;

[0031] (3) Move the LED semi-finished product to an oven at 80-100°C and bake for 20-40 minutes, and finally come out from the mold cavity to complete the glue filling and packaging process;

[0032] The content of each component and the weight percentage of each component in the LED sealant is:

[0033] Urethane Acrylate 40%

[0034] Epoxy Acrylate 30%

[0035] Hydroxyethyl (meth)acrylate 21%

[0036] 1-Hydroxycyclohexyl phenyl ketone 3%

[0037] Polyether modified silicone 0.5%

[0038] Nano-copper powder with a particle size of 50nm 5%

[0039] Dimethicone 0.5%.

Embodiment 2

[0041] A LED potting and encapsulating process, comprising the steps of:

[0042] (1) Take the LED sealant, stir for 3-5 minutes under dark conditions, and set aside;

[0043] (2) Inject the LED sealant into the molding cavity, then insert the pressure-welded LED bracket, and irradiate with ultraviolet light for 5-10 minutes to cure the LED sealant to obtain an LED semi-finished product;

[0044] (3) Move the LED semi-finished product to an oven at 80-100°C and bake for 20-40 minutes, and finally come out from the mold cavity to complete the glue filling and packaging process;

[0045] The content of each component and the weight percentage of each component in the LED sealant is:

[0046] Urethane Acrylate 20%

[0047] Epoxy Acrylate 60%

[0048] Hydroxypropyl (meth)acrylate 10%

[0049] 2-Hydroxy-2-methyl-1-phenyl-1-propanone 4%

[0050] Polyester modified silicone 0.5%

[0051] Nano silver powder with a particle size of 200nm 5%

[0052] Modified polysiloxane 0.5%. ...

Embodiment 3

[0054] A LED potting and encapsulating process, comprising the steps of:

[0055] (1) Take the LED sealant, stir for 3-5 minutes under dark conditions, and set aside;

[0056] (2) Inject the LED sealant into the molding cavity, then insert the pressure-welded LED bracket, and irradiate with ultraviolet light for 5-10 minutes to cure the LED sealant to obtain an LED semi-finished product;

[0057] (3) Move the LED semi-finished product to an oven at 80-100°C and bake for 20-40 minutes, and finally come out from the mold cavity to complete the glue filling and packaging process;

[0058] The content of each component and the weight percentage of each component in the LED sealant is:

[0059] Urethane Acrylate 20%

[0060] Epoxy Acrylate 31%

[0061] Ethoxylated Hydroxyethyl (meth)acrylate and Lauryl (meth)acrylate 30%

[0062] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 5%

[0063] Polyacrylate 3%

[0064] Nano-aluminum powder with a particle size of 100nm 8%

[0065] ...

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Abstract

The invention relates to the technical field of LED potting, especially an LED potting technique. The technique comprises the following steps: LED sealing adhesive containing nano metal powder is taken, stirred for 3 to 5 minutes in a dark condition, and left on standby; the LED sealing adhesive is injected into a shaping mold cavity, a press-welded LED support is inserted, the sealing adhesive is irradiated by ultraviolet light for 5 to 10 minutes to be cured, and a semi-finished LED product is obtained; and the semi-finished LED product is moved to be baked in a baking oven at a temperature between 80 and 100 DEG C for 20 to 40 minutes, and finally an LED product is separated from the mold cavity so that the technique is completed. The nano-metal-powder-containing sealing adhesive cured by the ultraviolet light has a good heat-transferring effect and is used by the technique provided by the invention, so that the technique can effectively prevent the situation that a die does not function well due to local overheating caused by heat accumulation, and the thermal aging of the product is delayed.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED glue-filling packaging process with good heat dissipation performance. Background technique [0002] LED is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. The LED packaging technology plays a key role in the light-emitting efficiency of light-emitting diodes. [0003] Ultraviolet curing (UV curing) technology is characterized by environmental protection and fastness. Compared with thermal curing technology, the advantages of UV curing technology are fast and low energy consumption. Solvent-based adhesives usually require an inert solvent, which is a volatile organic compound, and the curing reaction speed is slow at room temperature. Although the curing time can be shortened when heated, it consumes a lot ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/64C09J175/14C09J163/10C09J11/04
CPCH01L33/56C08K2201/003C08K2201/011C08L2201/08C09J11/04C09J163/10C09J175/14H01L33/641H01L2933/005H01L2933/0075C08L63/10C08K2003/085C08L75/14C08K2003/0806C08K2003/0812C08K2003/0862
Inventor 严加彬
Owner 江苏华程光电科技有限公司
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