Flexible metal foil laminate and method for producing the same

A flexible metal, manufacturing method technology, applied in metal layered products, chemical instruments and methods, manufacturing printed circuit precursors, etc., can solve problems such as low adhesion, achieve excellent adhesion and dimensional stability, inhibit Effects of poor appearance problems

Active Publication Date: 2016-08-24
NEXFLEX CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the flexible metal foil laminate with the above-mentioned structure has low adhesion to anisotropic conductive film (ACF, Anisotropic Conductive Film) used in liquid crystal display devices, touch panels, etc.

Method used

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  • Flexible metal foil laminate and method for producing the same
  • Flexible metal foil laminate and method for producing the same
  • Flexible metal foil laminate and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0122] With the contents in Table 1, 1638 g of PDA and 758 g of diamine of ODA were stirred and completely dissolved in 32416 g of DMAc solution under a nitrogen atmosphere, and then 5700 g of BPDA was added in fractions as dianhydride. Thereafter, stirring was continued for about 24 hours, thereby preparing a polyamic acid solution. After casting (casting) the polyamic acid solution prepared in this way into a film with a thickness of 20 μm, the temperature was raised to 350° C. over 60 minutes and maintained for 30 minutes to cure. The measured linear thermal expansion coefficient and glass transition temperature were 13.3 ppm / K and 321° C., respectively.

Synthetic example 2

[0123] Synthesis Example 2 to Synthesis Example 3

[0124] It was prepared by the same method as Synthesis Example 1 using the composition and content in Table 1, and Table 1 shows the measured linear thermal expansion coefficient and glass transition temperature.

[0125] Table 1. Composition of polyamic acid solution and linear thermal expansion coefficient and glass transition temperature after complete imidization

[0126]

Embodiment 1

[0128] After coating the polyamic acid solution prepared in Synthesis Example 2 on an electrolytic copper foil (roughness Rz = 2.0 μm) with a thickness of 12 μm so that the final cured thickness becomes 4 μm, it was dried at 130° C. A first polyimide precursor layer was formed. The polyamic acid solution prepared in Synthesis Example 1 was coated on one side of the first polyimide precursor layer so that the final cured thickness was 13 μm, and then dried at 150° C. to form the second polyimide precursor layer. Polyimide precursor layer. After that, the thermoplastic polyamic acid solution prepared in Synthesis Example 3 was coated on one side of the second polyimide precursor layer so that the thickness after final curing was 3.5 μm, and then dried at 150° C. to form A third polyimide precursor layer was formed. The multi-layer polyimide precursor layer on the copper foil produced in this way was completely imidized according to the curing condition 1 in Table 2 by using an...

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Abstract

The present invention relates to a flexible metal foil laminate comprising a multilayer polyimide film, said multilayer polyimide film comprising: a metal foil; a first polyimide layer on said metal foil, and having a glass transition temperature below 300°C; the second polyimide layer is located on the first polyimide layer; and the third polyimide layer is located on the second polyimide layer. The flexible metal foil laminate of the present invention solves the problem of poor appearance caused by blistering during the curing process in a continuous curing machine using infrared rays as a heat source, and does not cause delamination due to its excellent adhesion. The directional conductive adhesive film has excellent adhesion and dimensional stability, so it is useful in the manufacture of flexible printed circuit boards.

Description

technical field [0001] The present invention relates to a flexible metal foil laminate used in the manufacture of a flexible printed circuit board, and more specifically relates to manufacturing by heating polyamic acid, which is a precursor of polyimide, under high temperature conditions and finally converting it into polyimide A flexible metal foil laminate and a method of manufacturing the same. Background technique [0002] Flexible Metal Clad Laminate, used in the manufacture of Flexible Printed Circuit Boards, is a laminate of conductive metal foil (Metal Foil) and insulating resin, enabling fine circuit processing , and can be bent in a narrow space. Accordingly, the use of flexible metal foil laminates in notebook computers, portable information terminals, small video cameras, storage disks, and the like has been increasing in line with the trend toward miniaturization and weight reduction of electronic equipment. [0003] The flexible metal foil laminate related t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B37/02
CPCH05K1/0346H05K1/036H05K1/0393H05K3/022H05K2201/0154H05K2201/068Y10T156/10Y10T428/24942B32B15/08C08G73/10H05K1/03
Inventor 金燮澔李庸石崔元重金大年金永道
Owner NEXFLEX CO LTD
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