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A kind of manufacturing method of heat dissipation coating for LED aluminum substrate

A technology of LED aluminum substrate and heat dissipation coating, which is applied in coatings, devices for coating liquid on the surface, lighting and heating equipment, etc., can solve the problem of heat dissipation limitation of high-power LED packaging, and achieve high reliability and good heat dissipation Properties, effects of ultra-thin coatings

Inactive Publication Date: 2016-04-20
湖南元素密码石墨烯高科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The future development of flexible substrates is expected to be applied to the thinning requirements of LCD backlight modules for car navigation, and high-power LEDs can meet the requirements of three-dimensional packaging. Basically, the flexible substrates are made of aluminum and take advantage of the high thermal conductivity of aluminum. With light weight characteristics, it can be made into a high-density packaging substrate, which can achieve flexible characteristics after thinning the aluminum substrate, and can also have high thermal conductivity characteristics, but it is also limited by the heat dissipation problem of high-power LED packaging.

Method used

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  • A kind of manufacturing method of heat dissipation coating for LED aluminum substrate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1. Composition ratio of insulating graphene heat dissipation copolymer resin

[0034] Methyl methacrylate 38.5%

[0035] Butyl Acrylate 11.5%

[0036] Ethyl methacrylate 2.5%

[0037] Acrylic 42.0%

[0038] N-methylolacrylamide 4.0%

[0039] Acrylamide 1.5%

[0040] Total monomer 100%

[0041] Initiator 0.45% (accounting for total monomer)

[0042] Ethanol 300% (accounting for the total amount of monomers)

[0043] Single-layer insulating graphene (thickness 0.33nm, length 3um) 180% (accounting for total monomer)

[0044] 2. Copolymerization process

[0045] a. Weigh 3 / 4 of the total amount of ethanol to dissolve N-methylol acrylamide and acrylamide composite monomer, and add it to ethanol to fully dissolve while stirring; then add the entire amount of single-layer insulating graphite while stirring Alkene, uniformly dispersed and fully stirred for 1.5 hours;

[0046] b. Weigh the rest of the monomers and dissolve them into 3 / 5 of the total amount of initiator...

Embodiment 2

[0051] 1. Composition ratio of insulating graphene heat dissipation copolymer resin

[0052] Methyl methacrylate 38.5%

[0053]Butyl Acrylate 11.5%

[0054] Ethyl methacrylate 2.5%

[0055] Acrylic 42.0%

[0056] N-methylolacrylamide 4.0%

[0057] Acrylamide 1.5%

[0058] Total monomer 100%

[0059] Initiator 0.45% (accounting for total monomer)

[0060] Ethanol 300% (accounting for the total amount of monomers)

[0061] Multi-layer insulating graphene (thickness 3nm, length 5um) 280% (accounting for the total amount of monomers)

[0062] 2. Copolymerization process

[0063] a. Weigh 3 / 4 of the total amount of ethanol to dissolve N-methylol acrylamide and acrylamide composite monomer, and add it to ethanol to fully dissolve while stirring; then add the entire amount of single-layer insulating graphite while stirring Alkene, uniformly dispersed and fully stirred for 1.5 hours;

[0064] b. Weigh the rest of the monomers and dissolve them into 3 / 5 of the total amount of...

Embodiment 3

[0069] Composition ratio of PCB printing heat dissipation coating aluminum substrate:

[0070] Adopt the obtained insulating graphene heat dissipation copolymer resin of embodiment 1, namely:

[0071] Single layer insulating graphene heat dissipation copolymer resin 20%

[0072] Ethyl acetate 35%

[0073] Ethanol 25%

[0074] Butanol 15%

[0075] Aminophenolic resin 5%

[0076] The heat-dissipating coating on the above-mentioned aluminum substrate is mainly used to make a PCB heat-dissipating coated aluminum substrate for LED lamps. When the coating thickness is 0.8~1.0um, the drying temperature is 125°C, and the drying time is 5 minutes. The thermal resistance of the all-glue aluminum substrate can reach 0.002°C / W.

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Abstract

The invention relates to a method for manufacturing a heat dissipation coating for an LED aluminum substrate. The method comprises the following step of using special raw materials comprising a plurality of acrylate monomers, single-lamella or multi-lamella insulating graphene and other components to produce a heat dissipation coating for the LED aluminum substrate by a certain grafting copolymerization synthesizing method. The heat dissipation coating disclosed by the invention can replace the conventional heat dissipation coating for the LED aluminum substrate; by virtue of the heat dissipation coating for the LED aluminum substrate disclosed by the invention, the high thermal conductivity coefficient characteristic of the single-lamella or multi-lamella insulating graphene can be given into a full play to modify the heat dissipation coating for the LED aluminum substrate so as to maximize heat dissipation and insulation, the heat dissipation coating is an environment-friendly and low-usage heat dissipation coating for the LED aluminum substrate; the prepared heat dissipation coating for the aluminum substrate has the advantages of very good abrasion resistance and high thermal conductivity and good heat dissipation characteristics, is ultrathin and uniform and can be matched with the high-power LED.

Description

technical field [0001] The invention relates to a method for manufacturing a heat dissipation coating for an LED aluminum substrate. Background technique [0002] Due to the high energy conversion efficiency of LED lighting products, the energy consumption is theoretically only 10% of that of incandescent lamps. Compared with fluorescent lamps, LED lighting products can achieve 50% energy-saving effects. Therefore, they have the advantages of energy saving, environmental protection and long life, and can be widely used in landscapes. The lighting fields such as lighting, safety lighting, special lighting and general lighting sources have huge market potential. [0003] In general, the luminous wavelength of LED varies with temperature by 0.2-0.3nm / ℃, and the spectral width increases accordingly, which affects the color vividness. In addition, when the forward current flows through the pn junction, when the exothermic loss causes the temperature rise in the junction area, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D151/10C09D161/00C09D5/00C09D5/25C08F292/00C08F220/14C08F220/18C08F220/58C08F220/56B05D7/14B05D7/24F21V29/00F21Y115/10
Inventor 谭彬兰育辉
Owner 湖南元素密码石墨烯高科技有限公司