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A method for producing diamond wire using a diamond wire production device

A production device, diamond wire technology, applied in the direction of coating, electrolytic components, electrolytic process, etc., can solve the problems of affecting the cutting effect, slow speed, uneven distribution, etc., to save time for electroplating, high efficiency, and low internal stress Effect

Active Publication Date: 2016-07-13
湖南奇亮磨具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of these two methods are that the speed is slow, and the diamond particles are affected by their own weight and resistance during movement, so they cannot be evenly distributed on the steel wire, thus affecting the cutting effect

Method used

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  • A method for producing diamond wire using a diamond wire production device

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] See figure 1 , the production device of the diamond wire of the present embodiment includes an upper sand cylinder 1, a nickel block located in the upper sand cylinder 1 and a steel wire 2 suitable for passing through the central axis of the upper sand cylinder 1, and the steel wire 2 is in the form of Negative pole, the bottom of the upper sand drum 1 is provided with a rotating magnetic field generating device, which is suitable for generating a magnetic field that rotates around the central axis of the upper sand drum, and the magnetic field lines are suitable for cutting the plating in the upper sand drum 1 when the magnetic field rotates. solution, so that a radial current is generated in the plating solution and the diamond particles treated with cations are combined with nickel ions on the steel wire 2.

[0026] The rotating magnetic field generating device includes: 2 to 8 pairs of magnetic blocks 4 arranged radially and symmetrically on the same circumference o...

Embodiment 2

[0032] The production method of the diamond wire of the present embodiment comprises the following steps:

[0033] The first step: surface treatment of steel wire

[0034] The first is to clean the grease and oxide layer on the surface of the steel wire. The cleaning method is to wash with lye and then wash with water, then wash with weak acid and then wash with water.

[0035] Step 2: Choose the right diamond particles

[0036] The size of the diamond particles is determined according to the diameter of the steel wire. The size of the diamond particles is preferably 10-50um. At the same time, the selected diamond particles should be treated with cations, because the quality of the diamond particles will determine the quality of the diamond particles. The quality of the line is good or bad.

[0037] Step 3: Prepare diamond electroplating solution

[0038] The quality of the diamond electroplating solution determines the bonding strength and the bonding time of the diamond p...

Embodiment 3

[0046] Choose 0.11mm steel wire and thread it into the equipment;

[0047] Preparation of diamond electroplating solution: Weigh 60000g of nickel sulfamate, 3000g of nickel chloride, and 4500g of boric acid, put these chemical raw materials into the plating solution preparation tank, add pure water to the tank for preparing the plating solution and keep stirring, the final plating solution When it reaches 150 liters, extract 70 liters of electroplating solution and add it to the electroplating tank, then add 2100 g of cation-treated diamond micropowder into the electroplating tank, stir the electroplating solution and heat it to 50 degrees, and the preparation of the electroplating solution is completed.

[0048] Start the wire take-up machine, adjust the speed to 3 meters per minute, and apply 0.5 ampere direct current to the steel wire. At this time, the 0.11mm steel wire will pass through the upper sand cylinder under the traction of the guide wheel, and the diamond particle...

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Abstract

The invention relates to a method for producing a diamond wire by using a production apparatus for the diamond wire. The production apparatus comprises an upper sand cylinder and a steel wire adaptive to passing through the central axis of the upper sand cylinder, wherein the steel wire is cathodic and the lower end of the upper sand cylinder is provided with a rotating field generation apparatus. The production method comprises the following steps: A, carrying out surface treatment on the steel wire; B, preparing a plating solution; C, putting the plating solution in an upper sand groove, inputting the plating solution into the upper sand cylinder from the upper sand groove and connecting a nickel block in the upper sand cylinder with a direct current positive electrode; and D, allowing the steel wire to enter from the center of the lower end of the upper sand cylinder and exit from the center of the upper end of the upper sand cylinder, connecting the passing steel wire with a direct current positive electrode, allowing the rotating field generation apparatus to produce a magnetic field rotating around the central axis of the upper sand cylinder and allowing magnetic force lines to cut the plating solution in the upper sand cylinder so as to enable a radial current to be generated in the plating solution and nickel ions and diamond particles treated by positive ions to be bonded with the steel wire together.

Description

technical field [0001] The invention relates to the technical field of diamond wires, in particular to a method for producing diamond wires using a diamond wire production device. Background technique [0002] Hard and brittle materials such as silicon crystals, sapphire, and quartz crystal materials have developed rapidly in recent years, and the cutting processes for these materials mainly include inner and outer circle cutting and wire saw cutting. Due to the advantages of wire saw cutting: high efficiency and low cost , narrow slit, and little pollution have basically replaced other cutting methods. In wire saw cutting, diamond wire cutting is much better than sand wire cutting. The cutting efficiency of diamond wire is 3 times that of sand wire cutting, and the kerf is smaller, especially for silicon wafer cutting. The silicon wafer light energy conversion of diamond wire cutting The rate is higher than that of silicon wafers cut by sand wire. [0003] At present, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D7/06
CPCC25D3/12C25D5/22C25D7/0607C25D15/00C25D17/00
Inventor 刘辉周才英邱军林
Owner 湖南奇亮磨具有限公司