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Intelligent power module and manufacturing method thereof

A technology of intelligent power modules and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc. Effects of long-term reliability, improved corrosion resistance, and reliable connection

Inactive Publication Date: 2014-10-22
GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The smart power module 100 generally works in harsh working conditions, such as the outdoor unit of an inverter air conditioner, under high temperature and high humidity conditions, the gap 103 is easily invaded by water vapor, which will corrode aluminum or copper when it is used for a long time. It will cause the pin 101 to become thinner. For some pins 101 that need to withstand high current and high voltage, heat accumulation is likely to occur in the thinned part, which accelerates the corrosion process of the pin 101 and eventually causes the pin 101 to fuse. Smart power Module 100 fails
[0006] In addition, referring to FIG. 1(C), because the pins 101 of the traditional smart power module 100 are connected by ribs 109 during the manufacturing process, when manipulators and workers in the manufacturing process carry the smart power module 100 by clamping the pins 101 , is generally achieved by clamping two pins 101 on opposite sides. In this way, the connection between the pins 101 and the circuit wiring 108 will generate a large tensile force, which will cause loose welding. In the injection molding and forming process, it is possible Part of the pin 101 is separated from the circuit wiring, causing an open circuit, which seriously affects the pass rate of the process; if the pin 101 and the circuit wiring 108 are partially separated but not completely separated, such a product is difficult to detect during the finished product test. After entering the market, after a period of use, it will cause open circuit failure, make the equipment stop working, and in serious cases, the equipment will be out of control and burn down.

Method used

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  • Intelligent power module and manufacturing method thereof
  • Intelligent power module and manufacturing method thereof
  • Intelligent power module and manufacturing method thereof

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] 2(A), 2(B) and 2(C), the intelligent power module includes pins 11 , sealing layer 12 , circuit elements 14 , bonding wires 15 , substrate 16 , insulating layer 17 , and circuit wiring 18 .

[0034] The insulating layer 17 covers the upper surface of the substrate 16 , the circuit wiring 18 is disposed on the surface of the insulating layer 17 , and the circuit element 14 is arranged at a corresponding position of the circuit wiring 18 . The circuit wiring 18 includes element pads for arranging the circuit elements 14, lead pads 18A for soldering the pins 11...

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Abstract

The invention is suitable for the technology of electronic devices, and provides an intelligent power module and a manufacturing method thereof. The intelligent power module comprises a substrate of which the upper surface is covered with an insulating layer, circuit wiring which is arranged on the surface of the insulating layer, and circuit elements which are arranged on corresponding positions of the circuit wiring. The intelligent power module also comprises pins and a sealing layer. The pins are connected with the circuit wiring and extend outwardly from the substrate, and the pins are completely covered via a plating layer. The sealing layer is laid on the upper surface, which is provided with the circuit wiring and the circuit elements, of the substrate. The pins of the intelligent power module are completely sealed by the plating layer so that corrosion resistance of the intelligent power module is greatly enhanced, and the pins of the intelligent power module are ensured not to be burned out by local overheating in the long-term use process.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the intelligent power module receives the control signal of the MCU (Microprogrammed Control Unit, microprogram controller) to drive the subsequent circuit to work, and on the other hand, it sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, the intelligent power module wins more and more markets with its advantages of high integration...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48H01L21/60
CPCH01L2924/19105H01L2224/48091H01L2224/48472H01L2224/4903H01L2924/00014H01L2924/00
Inventor 冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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