Thick copper circuit board with 12 OZ outer layer and solder-resist manufacturing method of thick copper circuit board

Abstract

The invention discloses an outer layer 12OZ thick-copper circuit board and a solder-mask manufacturing method of the outer layer 12OZ thick-copper circuit board. The method comprises the following steps of carrying out brown oxidation on outer layer circuits, carrying out resin coating among circuits, grinding a plate, drilling a hole and carrying out green oil silk screen. When resin coating among the circuits is carried out, resin ink is coated among the circuits by adopting a silk-screen method, standing is carried out for 10min to 30min for bubbles to be overflown, and pre-baking and solidification are carried out. The technical parameters of the silk-screen method are as follows: a squeegee angle of a screen printing machine is 20 degrees to 30 degrees, a scrapper is 25mm to 35mm, a silk screen is tensioned obliquely in 13 degrees to 17 degrees. When the plate is grinded, sandbag plate grinding is adopted for one to three times and ceramic plate grinding for one or twice. The hole is drilled by being divided into three sections, the proportion of all sections is 1 : 0.9 to 1.1 : 0.9 to 1.1. According to the solder-mask manufacturing method of the outer layer 12OZ thick-copper circuit board, solder-mask performance of outer layer circuits is improved by adopting an increasing method, the phenomena that oil ink is uneven, copper is exposed due to oil leakage and partial circuits corrode after surface treatment, and the outer layer 12OZ thick-copper circuit board is made to be good in appearance, electrical performance and reliability.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board with anti-soldering, in particular to a circuit board with an outer layer of 12OZ thick copper and a method for manufacturing the same. Background technique [0002] The outer 12OZ thick copper circuit board is used as an automotive electronic component, especially in high-power and high-voltage parts such as engine power supply parts and automotive central electrical power supply parts. It requires circuit boards to have characteristics such as heat aging resistance and high and low temperature cycle resistance. [0003] However, the current green oil anti-soldering technology of the outer layer 12OZ thick copper plate has the following technical difficulties and hidden dangers in reliability: [0004] (1) For the coating of solder resist (commonly known as green oil), according to the existing electrostatic spraying and printing method, the thickness uniformity of the green oil coati...

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Problems solved by technology

[0004] (1) For the coating of solder resist (commonly known as green oil), according to the existing electrostatic spraying and printing method, the thickness uniformity of the green oil coating on the line with a bottom copper thickness of up to 12OZ is poor. The thickness is difficult to be guaranteed, and the uniformity of the green oil thickness on the wire surface cannot be guaranteed, which may easily cause oxidation or short circuit of exposed copper on the surface, affecting the electrical performance of the product and the safety of long-term use

[0005] (2) There are sharp corners on the top edge of the line, and the ink adhesion is poor

Because the outer 12OZ thick copper plate will produce a large side erosion effect during etching, the sharp corners of the top of the line will have poor adhesion, which will seriously affect the adhesion, thickness and reliability requirements of the line green oil

[0006] (3) Due to repeated etching of the outer 12OZ thick copper circuit, the side erosion of the circuit is more serious than that of ordinary copper, and there are likely to be gaps at the contact between the ink and the circuit. When the surface treatment such as sinking tin is easy to cause the circuit to be corroded due to the original battery effect, affecting the electrical performance and product reliability

[0007] (4) During the drilling process, due to the mismatch between resin drilling and thick copper drilling, it is easy to cause resin cracking at the edge of the hole

[0008] It can be seen that the existing production methods have potential safety hazards affecting the quality and reliability of solder mask production.

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