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Gold alloy solder paste and preparation method thereof

A gold alloy welding and alloy powder technology, which is applied in the field of new gold alloy and its preparation, can solve the problems of difficult precise control of material composition and alloy melting temperature range utilization rate, etc.

Inactive Publication Date: 2016-08-24
KUNMING INST OF PRECIOUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some defects in the above-mentioned method for preparing gold alloy brazing materials, and it is difficult to accurately control the material composition, alloy melting temperature range, utilization rate, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0010] Example 2: Gold powder, gallium powder, germanium powder, antimony powder, tellurium powder, tin powder, etc. with a purity of 99.995% and a particle size of -250 mesh (average particle size －2 Pa; under room temperature and water-cooling conditions, high-energy ball milling was carried out at a speed of 1000 rpm for 10 hours to obtain gold alloy powder; the alloy powder was mixed with a binder, and the composition and ratio of the specific binder were: B2 3% alcohol ether solvent, 25% butyl acetate additive, 15% acrylic resin binder, and the remaining filler is gold alloy powder; put flux, additive, binder and filler into a mixing container, and stir and mix For 2 hours, the stirring speed was 1500 rpm, and a gold alloy solder paste for brazing materials was prepared. The properties of the brazing material are: melting point 850°C, average powder particle size <20μm, solder paste viscosity 15s.

Embodiment 3

[0011] Example 3: Gold powder, gallium powder, germanium powder, antimony powder, tellurium powder, tin powder, etc. with a purity of 99.995% and a particle size of -325 mesh (average particle size－2 Pa; under room temperature and water-cooled conditions, high-energy ball milling was carried out at a speed of 2000 rpm for 15 hours to obtain gold alloy powder; the alloy powder was mixed with a binder, and the composition and ratio of the specific binder were: B2 5% alcohol ether solvent, 30% butyl acetate additive, 20% acrylic resin binder, and the remaining filler is gold alloy powder; put the flux, additive, binder and filler into a mixing container, and stir and mix For 3 hours, the stirring speed was 2000 rpm, and a gold alloy solder paste for brazing materials was prepared. The properties of the brazing material are: melting point 350°C, average powder particle size <16μm, solder paste viscosity 10s.

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Abstract

The invention relates to a novel gold alloy material and a method for manufacturing the same, and belongs to the field of precious metal braze welding materials. The method for manufacturing gold alloy by the aid of a high-energy ball-milling technology includes preparing raw materials such as gold powder, gallium powder, germanium powder, antimony powder, tellurium powder and tin powder according to requirements of chemical compositions and a formula of the alloy, and performing mechanical high-energy ball-milling on the raw materials under a vacuum condition for 5-20 hours to manufacture gold alloy brazing filler metal powder; stirring and mixing the gold alloy brazing filler metal powder, solvents, auxiliaries, binders and the like for 1-3 hours to manufacture brazing filler metal welding paste. The particle sizes of the gold powder, the gallium powder, the germanium powder, the antimony powder, the tellurium powder and the tin powder are smaller than 200 meshes (the average particle sizes are smaller than 70 micrometers), and the purity of the gold powder, the gallium powder, the germanium powder, the antimony powder, the tellurium powder and the tin powder is higher than 99.995%. The novel gold alloy material and the method have the advantages that the alloy brazing filler metal powder manufactured by the aid of the method is excellent in product performance and low in manufacturing cost, processes for manufacturing the alloy brazing filler metal powder are controllable, the manufactured brazing filler metal welding paste is excellent in comprehensive performance, service requirements of relevant industries of integrated circuits, electronics, computers, electric appliances and the like can be met, and the like.

Description

technical field [0001] The invention relates to a novel gold alloy and a preparation method thereof, which belongs to the field of precious metal brazing materials and can be applied to integrated circuits, electronics, computers, electrical appliances and other related industries. Background technique [0002] Gold alloy solder is an important solder used in integrated circuits, semiconductor devices, computers, electronics and other industries. It has better thermal conductivity and electrical conductivity than tin-based or lead-based solders, as well as higher heat resistance. fatigue performance, etc. Due to the formation of hard and brittle intermetallic compounds, gold-based alloys are difficult to process and form. At present, the commonly used preparation methods in Germany, the United States, Japan, and relevant domestic units include: multi-layer composite method, stripping method, and magnetron sputtering method. , electron beam evaporation, electroplating, etc. ...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40C22C5/02C22C1/04
CPCB22F2301/255B22F2301/30B22F2302/45B22F2303/01B22F2303/10B23K35/3013B23K35/40C22C1/0466C22C1/1084C22C5/02
Inventor 谢明张吉明胡洁琼杨有才陈永泰王松王塞北陈松李爱坤魏宽刘满门
Owner KUNMING INST OF PRECIOUS METALS