A preparation method of n-type crystalline silicon heterojunction solar cell with full back electrode
A technology of solar cells and full back electrodes, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of reducing open circuit voltage, increasing potential barriers, and electrons are difficult to N-region electrodes, so as to increase open circuit voltage and increase light-receiving area , Improve the effect of conversion efficiency
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Embodiment 1
[0048] Example 1, such as Figure 1-10 Shown, a kind of preparation method of full back electrode N-type crystalline silicon heterojunction solar cell comprises the following steps,
[0049] (1) Using a metal-catalyzed chemical etching method, a pyramid-like nano-texture surface is prepared on the front surface of the N-type silicon substrate. The size of the nano-texture surface is 200nm, and then the residual metal particles and other harmful substances are cleaned by a cleaning process;
[0050] (2) Through high-temperature diffusion of phosphorus source, N-type silicon substrate is prepared on the back of N-type silicon substrate ++ Type phosphorus re-diffusion layer crystalline silicon layer, its thickness is 0.3μm, sheet resistance is 80ohm / Sq;
[0051] (3) Through the high-temperature and shallow diffusion of phosphorus source, the N-type silicon substrate is prepared on the back side of the N-type silicon substrate. + Type phosphorus shallow diffusion layer crystalli...
Embodiment 2
[0059] Example 2, such as Figure 1-10 Shown, a kind of preparation method of full back electrode N-type crystalline silicon heterojunction solar cell comprises the following steps,
[0060] (1) Using a metal-catalyzed chemical etching method, a pyramid-like nano-texture surface is prepared on the front surface of the N-type silicon substrate. The size of the nano-texture surface is 150nm, and then the residual metal particles and other harmful substances are cleaned by a cleaning process;
[0061] (2) By ion implantation, the N-type silicon substrate is prepared on the back of the N-type silicon substrate. ++ Type phosphorus re-diffusion layer crystalline silicon layer, its thickness is 0.2μm, sheet resistance is 70ohm / Sq;
[0062] (3) By ion implantation, the N-type silicon substrate is prepared on the back of the N-type silicon substrate. + Type phosphorus shallow diffusion layer crystalline silicon layer, its thickness is 0.2μm, sheet resistance is 150ohm / Sq;
[0063] (...
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