Silicon chip diffusion treatment method and solar cell manufacturing method

Abstract

The invention relates to a silicon chip diffusion treatment method and a solar cell manufacturing method which are higher in production efficiency and can effectively prevent chip bonding phenomena. According to the silicon chip diffusion treatment method, before diffusion source deposition of silicon chips, an oxidizing layer with a certain thickness is generated on the surface of the silicon chips through thermal growth and is used as an insulating layer through the method, so that chips can be clung to one another to be processed, chip bonding phenomena during the diffusion source deposition can be prevented, the flux is improved, and chip processing in high efficiency can be realized.

Description

technical field [0001] The invention relates to the field of manufacturing solar cells, in particular to a silicon chip diffusion treatment method and a method for manufacturing solar cells. Background technique [0002] Solar cells need a large-area PN junction to realize photoelectric conversion, and the diffusion furnace is a special equipment for manufacturing PN junctions of solar cells. The traditional tubular diffusion furnace is mainly composed of four parts: the upper and lower parts of the quartz boat, the exhaust gas chamber, the furnace body and the gas cabinet. Diffusion generally uses phosphorus oxychloride liquid source as the diffusion source; during the diffusion process, the P-type silicon wafer is placed in the quartz container of the tubular diffusion furnace, and nitrogen is used to bring phosphorus oxychloride into the quartz container at a high temperature of 850-900 °C , phosphorus oxychloride reacts with silicon wafers to obtain phosphorus atoms; af...

AI Technical Summary

Problems solved by technology

However, in the traditional silicon wafer diffusion process, it is generally necessary to use slotted boats (such as quartz boats, etc.) to separate the silicon wafers, so as to prevent the silicon wafers from sticking during the high temperature diffusion process after the silicon wafers are tightly bonded together, resulting in the scrapping of the silicon wafers

However, although the use of slotted boats and other devices can avoid the occurrence of chip sticking, it is not conducive to the improvement of chip throughput and affects the production efficiency of products

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