Production technology and mixed emulsion device for improving stability of soldering flux for soldering paste

Abstract

The invention discloses a production technology and a mixed emulsion device for improving the stability of a soldering flux for soldering paste. According to the production technology and the mixed emulsion device, mixed emulsion is carried out at low temperature, so that rosin can be effectively prevented from volatilizing and being oxidized at high temperature, and the activity of the welding flux can be kept to the greatest extent; air in the welding flux can be exhausted by adopting low vacuum degree, so that not only can gas in the welding flux be effectively exhausted, but also active ingredients in the welding flux can be prevented from volatilizing at high vacuum degree to lose activity, and the activity of the welding flux can be enhanced; two times of grinding process are adopted, wherein the prepared uniform mixed solution stands for 24 hours after the first time of grinding, so that rosin crystals in the welding flux can be sufficiently separated out, and then the second time of grinding is carried out, and large crystals are ground to meet the production requirements, so that the performance stability of the welding flux is improved; by adopting a manner of increasing scrapers, the mixed emulsion device can scrap sticky and thick objects on the inner wall of and at the bottom of a container into mixed liquid, so that the purpose of fully mixing can be reached, and the performance stability of the welding flux can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a production process for improving the stability of flux used in solder paste and a mixing and emulsifying device thereof. Background technique [0002] With the miniaturization of electronic information products, the assembly density of components on PCB boards is getting higher and higher, and the spacing between pads is getting smaller and smaller, which makes the quality requirements of solder paste in various countries more and more stringent. The stability of solder paste performance directly affects the reliability and defect rate of electronic products. Most domestic solder paste products are particularly prone to dryness and aging, and it is difficult to meet their quality stability requirements. In addition to the quality problems of the tin powder itself, most of them are due to the change in the performance of the flux used in the solder paste, which leads t...

AI Technical Summary

Problems solved by technology

[0004] Traditional flux emulsification devices use one or more high-speed rotating emulsification and dispersion impellers to crush and disperse solid particles, and drive the solution to flow at high speed in the container to mix materials, but for substances such as rosin, within 100- It is in a softened and viscous state at 140°C, and a large part of rosin will stick to the inner wall or bottom of the container, making it difficult to separate and dissolve into the liquid, resulting in uneven mixing of the product and affecting the quality of the flux. Materials in the flux The problem of uneven mixing needs to be solved urgently

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