High-performance lead-free halogen-free soldering flux for soldering paste and preparing method of soldering flux

A lead-free solder paste, high-performance technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems that cannot meet the development requirements of electronic mounting technology, so as to prolong the service life and storage time, ensure stable performance, Effect of reducing crystallization

Inactive Publication Date: 2014-12-03
JIANGSU BOQIAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the currently used lead-free and halogen-free fluxes are only suitable for tin powder with a particle size of more than 20 μm, which can no longer meet the development requirements of electronic mounting technology

Method used

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  • High-performance lead-free halogen-free soldering flux for soldering paste and preparing method of soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add 28.5g of diethylene glycol monooctyl ether, 35g of perhydrorosin, and 15g of disproportionated rosin into the reaction vessel, heat to 115°C and stir until the rosin is completely dissolved in diethylene glycol monooctyl ether; cool down to 75°C, and add 3.5g of 16 acid, 2.5g of 24 acid, 2g of triethanolamine, 3.5g of benzotriazole, fully stirred until mixed evenly; cooled to 20°C, added 5.5g of polyoxyethylene glyceryl ether, 4.5g of hydrated castor oil, stirred and Vacuum until it is uniformly mixed, and grind the solid particles in the uniformly mixed solution to less than 10 μm with a three-roll mill to obtain 98 g of halogen-free flux for lead-free solder paste.

Embodiment 2

[0024] Add 30g of triethylene glycol monobutyl ether, 34g of perhydrorosin, and 13g of maleic rosin into the reaction vessel, heat to 117°C and stir until the rosin is completely dissolved in the solvent; cool down to 77°C, add 4g of salicylic acid, 3g of 24 acid, 2g of triethanolamine, 2.5g of benzotriazole, fully stirred until mixed evenly; cooled to 22°C, added 6.5g of polyoxyethylene glyceryl ether, 5g of hydrogenated castor oil, stirred and vacuumed until mixed evenly, Grind the solid particles in the homogeneously mixed solution to less than 10 μm with a three-roll mill to obtain 96 g of halogen-free flux for lead-free solder paste.

Embodiment 3

[0026] Add 28g of triethylene glycol monobutyl ether, 30g of perhydrorosin, 13g of disproportionated rosin, and 5g of maleic rosin into the reaction vessel, heat to 119°C and stir until the rosin is completely dissolved in the solvent; cool down to 79°C, and add 24 acid 7g, diethanolamine 2g, benzotriazole 3.5g, fully stirred until mixed evenly; cooled to 22°C, added polyoxyethylene glyceryl ether 6.5g, hydrogenated castor oil 5g, stirred and vacuumed until mixed evenly, with three The roller grinder grinds the solid particles in the homogeneously mixed solution to less than 10 μm to obtain 97 g of halogen-free flux for lead-free solder paste.

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Abstract

The invention relates to the technical field of welding materials, in particular to a high-performance lead-free halogen-free soldering flux for soldering paste and a preparing method of the soldering flux. The high-performance lead-free halogen-free soldering flux for the soldering paste comprises the following ingredients in percentage by mass: 20 percent to 30 percent of solvents, 30 percent to 50 percent of rosins, 3 percent to 8 percent of surfactants, 2 percent to 5 percent of thixotropic agents, 5 percent to 10 percent of organic acid, 2 percent to 5 percent of organic amine and 2 percent to 5 percent of corrosion inhibitors. The high-performance lead-free halogen-free soldering flux and the preparing method provided by the invention have the beneficial effects that various kinds of rosins are adopted for compounding, the crystallization separation of single rosin in the saturation state is reduced, and the stability of the soldering flux is guaranteed; the organic acid and the organic amine are matched to be used, and generated active substances can destroy oxide films at the surfaces of tin powder and a bonding pad at high temperature, so that the effect of soldering aids is achieved; benzotriazole is adopted as the corrosion inhibitors, so the service life and the preservation time of the soldering paste can be effectively prolonged.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a halogen-free flux for high-performance lead-free solder paste and a preparation method thereof. Background technique [0002] Welding is an important technology in the assembly process of electronics and microelectronics. The quality of solder paste directly affects the quality of welding, and in Solder Among them, flux is an indispensable auxiliary material, and its role is extremely important. It can not only remove oxides and impurities on the metal surface, but also prevent metal oxidation during heating, help solder flow, and reduce the surface tension of solder. , quickly transfer heat from the tip of the soldering iron to the surface of the solder and the object to be soldered. With the development of the electronic information industry, people's awareness of environmental protection has gradually strengthened. Countries around the world have put forward req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/40B23K2101/36
Inventor 戴爱斌尹计深陈世远
Owner JIANGSU BOQIAN NEW MATERIALS
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