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A technology for metal parts and polishing liquid, applied in the field of polishing liquid, can solve the problems of deep damage layer and poor surface finish, and achieve the effects of high efficiency, good oil removal and high polishing accuracy
Inactive Publication Date: 2014-12-10
QINGDAO QIYUAN ZHENDONG ELECTRIC
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Abstract
Description
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Problems solved by technology
In the previous polishing process, mechanical polishing was generally used. The mechanical polishing surface has high flatness, but the surface finish is poor and the damage layer is deep.
Method used
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Embodiment 1
[0010] A polishing solution for metal parts, made from the following raw materials in parts by weight:
[0011] 10 parts of sulfuric acid, 8 parts of hydrogen peroxide, 3 parts of nonylphenol polyoxyethylene ether, 1.5 parts of N-phosphine carboxymethyliminodiacetic acid, 0.5 parts of tetramethylenediamine tetramethylene phosphonic acid, dodecane 1.3 parts of sodium disulfate, 2.4 parts of ammonium diethylenetriaminepentaacetate, 2.3 parts of sodium salicylate, 3.5 parts of methyl methacrylate, 2.4 parts of defoamer, and the balance of water.
Embodiment 2
[0013] A polishing solution for metal parts, made from the following raw materials in parts by weight:
[0014] 20 parts of sulfuric acid, 15 parts of hydrogen peroxide, 8 parts of nonylphenol polyoxyethylene ether, 2.2 parts of N-phosphinecarboxymethyliminodiacetic acid, 1.3 parts of tetramethylenediamine tetramethylene phosphonic acid, dodecane 4 parts of sodium sulfate, 5 parts of ammonium diethylenetriamine pentaacetate, 3.6 parts of sodium salicylate, 6 parts of methyl methacrylate, 3.8 parts of defoamer, and the balance of water.
Embodiment 3
[0016] A polishing solution for metal parts, made from the following raw materials in parts by weight:
[0017] 15 parts of sulfuric acid, 11 parts of hydrogen peroxide, 5 parts of nonylphenol polyoxyethylene ether, 1.9 parts of N-phosphinecarboxymethyliminodiacetic acid, 0.8 parts of tetramethylenediamine tetramethylene phosphonic acid, dodecane 2.8 parts of sodium disulfite, 3.7 parts of ammonium diethylenetriaminepentaacetate, 3 parts of sodium salicylate, 4.8 parts of methyl methacrylate, 3.2 parts of defoamer, and the balance of water.
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PUM
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Abstract
The invention discloses a polishing solution for metal parts. The polishing solution is prepared from the following raw materials in parts by weight: 10-20 parts of sulfuric acid, 8-15 parts of hydrogen peroxide, 3-8 parts of nonylphenol polyoxyethylene ether, 1.5-2.2 parts of N-phosphine carboxymethyl iminodiacetic acid, 0.5-1.3 parts of tetramethylenediamine tetramethylene phosphonic acid, 1.3-4 parts of sodium lauryl sulfate, 2.4-5 parts of diethylene triamine pentaacetic acid, 2.3-3.6 parts of sodium salicylate, 3.5-6 parts of methyl methacrylate, 2.4-3.8 parts of antifoaming agent and the balance of water. The polishing solution for metal parts disclosed by the invention has the beneficial effects that the polishing solution is high in polishing precision and high in surface finish and has good performances such as antifouling resistance, rust resistance and cleaning and brightening performance.
Description
technical field [0001] The invention relates to a polishing liquid for metal parts. Background technique [0002] Polishing refers to the use of mechanical, chemical or electrochemical action to reduce the surface roughness of the workpiece to obtain a bright and smooth surface. It is a modification process on the surface of the workpiece by using flexible polishing tools and abrasive particles or other polishing media. In the previous polishing process, mechanical polishing was generally used. The mechanical polishing surface has high flatness, but the surface finish is poor and the damage layer is deep. It is not conducive to the precision of processing. Chemical polishing can obtain a more perfect surface and a higher polishing rate. Widely used in LED industry and semiconductor industry. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a polishing liquid with hig...
Claims
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Application Information
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