High-viscosity self-crosslinking LED package gum resin and preparation method thereof

Abstract

The invention discloses high-viscosity self-crosslinking LED package gum resin and a preparation method thereof. The preparation method comprises the following steps: sequentially adding the following components in parts by weight into a container: 100-105 parts of phenyltrimethoxysilane, 100-120 parts of diphenyldimethoxysilane, 10-20 parts of hydrogenous annulus, 20-60 parts of distilled water, 30-50 parts of divinyl tetramethyl disiloxane, 100-200 parts of a solvent and 3-5 parts of a catalyst; heating to 40-60 DEG C, and stirring at a constant temperature for 4-8 hours; heating to 100-130 DEG C, and stirring and reacting at a constant temperature for 4-8 hours; rinsing the reaction liquid to be neutral by using distilled water; distilling at reduced pressure of -0.096MPa at 200 DEG C to remove the solvent and residual moisture so as to obtain the high-viscosity self-crosslinking LED package gum resin which has the characteristics of high light transmittance and high refractive index.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high-viscosity self-crosslinking LED encapsulation resin and a preparation method thereof. Background technique [0002] At present, the commonly used LED packaging materials are epoxy resin and silicone materials. Epoxy resin is the most widely used because of its low price, but due to the poor heat resistance, moisture resistance and flexibility of epoxy resin, it is easy to turn yellow, brittle, Low impact strength, prone to stress cracking, shrinkage of the cured product, etc., will cause internal stress due to sudden temperature changes, which will disconnect the gold wire from the lead frame, thereby reducing the life of the LED, so it is not suitable for packaging of high-power LEDs. The packaging materials used in power LED devices require a refractive index higher than 1.5 (25°C) and a light transmittance of not less than 70% (the light transmitta...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the above-mentioned technical problems such as uneven mixing and poor compatibility of vinyl phenyl silicone resin and crosslinking agent before curing, and to provide a high refractive index, high light transmittance, easy to scale production A high-viscosity self-crosslinking LED encapsulation adhesive resin and a preparation method thereof, the molecular structure of the high-viscosity self-crosslinking LED encapsulation adhesive also contains molecular structures such as vinyl, phenyl, Si-H bonds, etc. The vinyl group of the structure and the Si-H bond undergo an addition reaction, which greatly reduces the technical problems of uneven mixing and poor compatibility in the current two-component encapsulation adhesive.

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