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Conductive paste, cured product, electrode and electronic equipment

A technology of conductive paste and conductivity, applied in the direction of conductive materials, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of poor wettability of solder metal, increased energy, no infiltration and expansion of molten solder metal, etc.

Active Publication Date: 2017-09-12
ARAKAWA CHEM IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when an electrode is formed using a conductive paste using such composite particles as a conductive filler, and electronic components are soldered on the electrode, the wettability of the molten solder metal may be poor.
Especially in solder paste using lead-free solder powder such as tin-silver-copper, this problem is significant
There are various reasons for this, but it is generally considered that one of the reasons is that the tin in the molten solder reacts with the composite particles in the electrode to form an alloy, and the interfacial energy between the solder metal and the electrode increases, and as a result, the molten solder metal no infiltrative extension

Method used

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  • Conductive paste, cured product, electrode and electronic equipment
  • Conductive paste, cured product, electrode and electronic equipment
  • Conductive paste, cured product, electrode and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] As shown in Table 1, component (A) was prepared by mixing 20% ​​by volume of component (a1) and 80% by volume of component (a2) below.

[0111] (a1) Components: Commercially available flat silver-coated copper powder (trade name "HP0420M1", made by Heesing Metal, with a silver shell thickness of about 0.28 μm, a ball-converted average primary particle diameter of about 8 μm, and a 99% cumulative particle diameter D99 of about 40μm).

[0112] (a2) Component: Spherical silver-coated copper powder (trade name "1400Y", manufactured by Mitsui Metal Mining Co., Ltd., average primary particle diameter in terms of balls is about 6 μm, 99% cumulative particle diameter D99 is about 12 μm).

[0113] Next, 85 parts of the (A) component (including 17 parts of the (a1) component and 68 parts of the (a2) component) were used as the (B) component of the commercially available resole type phenolic resin (trade name "BRL") using a planetary mixer. -275", 8.91 parts of Showa High Polymer...

Embodiment 2

[0115] Except that linoleic acid was used instead of oleic acid in Example 1, the conductive paste was prepared as in Example 1.

Embodiment 3

[0117] Except that linolenic acid was used instead of oleic acid in Example 1, the conductive paste was prepared as in Example 1.

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Abstract

This conductive paste comprises a conductive filler (A), a thermosetting phenolic resin (B), an unsaturated fatty acid (C), and an organic solvent (D). More specifically, the conductive filler (A) of the conductive paste has copper or a copper alloy as a core and silver as a shell. The thickness of the shell is 0.02 µm or more. Flat-plate-shaped coated particles (a1) having an aspect ratio of 2 or more are included at 0.1-30 vol%.

Description

technical field [0001] The invention relates to a conductive paste, a cured product obtained from the conductive paste, an electrode made from the cured product, and electronic equipment. Background technique [0002] The so-called conductive paste usually refers to silver (Ag) or copper (Cu), nickel (Ni), tin (Sn), aluminum (Al), carbon black and other granular conductive fillers and phenolic resin or epoxy A conductive composition prepared by blending a thermosetting binder resin such as resin and an organic solvent. Furthermore, since the conductive paste can easily and finely form electrodes of various shapes by screen printing or the like, it is applied to various electronic devices or electronic products. [0003] Copper and silver are currently used as conductive fillers excellent in conductivity. However, the problem is that copper is widely used because it is cheap, and on the other hand, it is easy to oxidize, which makes the conductivity of the conductive paste ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B1/00H05K1/09
CPCH01B1/026H01B1/22H05K1/095H05K3/3485H05K2201/0218H05K2201/0245
Inventor 岩村荣治相泽贵之
Owner ARAKAWA CHEM IND LTD