Manufacturing Process of Magnetic Sensing Device

Abstract

The invention discloses a manufacturing process of a magnetic sensing device, which includes: forming a dielectric material layer on a substrate; depositing magnetic materials and protective materials; forming an array of magnetic materials through exposure and etching processes; depositing barrier materials; and depositing conductive materials. ; Exposure and etching through the semiconductor process to form metal electrodes. Due to the protective effect of the barrier material, the metal etching process will stay above the barrier material to ensure the performance of the magnetic sensing device; remove the remaining barrier layer material between the magnetic materials; deposition The dielectric layer material is planarized with chemical mechanical polishing, and the through holes are opened through the photolithography process, a second layer of metal is deposited, and photolithography is performed to form metal connections. The invention uses a barrier layer to protect the magnetic material, avoids the use of this dielectric material layer, and can also reduce one photolithography layer and reduce costs. In addition, the process of the present invention helps to improve the contact between the metal and the magnetic material protective layer, thereby improving device performance and improving yield rate.

Description

technical field [0001] The invention belongs to the technical field of semiconductor technology and relates to a magnetic sensing device, in particular to a manufacturing process of the magnetic sensing device. Background technique [0002] According to its principle, magnetic sensors can be divided into the following categories: Hall elements, magneto-sensitive diodes, anisotropic magnetoresistance elements (AMR), tunnel junction magnetoresistance (TMR) elements and giant magnetoresistance (GMR) elements, induction coils , superconducting quantum interference magnetometer, etc. [0003] Electronic compass is one of the important application fields of magnetic sensors. With the rapid development of consumer electronics in recent years, in addition to navigation systems, more and more smart phones and tablet computers have also begun to be equipped with electronic compass as standard, bringing users In recent years, the demand for magnetic sensors has also begun to develop f...

AI Technical Summary

Problems solved by technology

At present, the simultaneous fabrication of three-axis sensors cannot be realized on a single wafer / chip

[0009] In addition, in the practical application of magnetic sensors, after the formation of the magnetic material array, it is generally covered with a dielectric layer, and then an opening is made on the dielectric layer, but this step is very prone to contact problems in the opened window area. If the problem is light, it will increase the contact resistance and affect the performance of the device. If it is serious, it will cause the connection between the metal and the magnetic material to fail, causing the device to fail to work. Therefore, it is a serious problem in the manufacture of magnetic sensors.

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