Organic silicon potting adhesive containing POSS group and preparation method of organic silicon potting adhesive

Abstract

The invention relates to an organic silicon potting adhesive containing a POSS (polysilsesquioxane) group and a preparation method of the organic silicon potting adhesive. The organic silicon potting adhesive comprises a component A and a component B and is characterized in that the component A is formed by a POSS-phenyl organosilicon polymer and excessive hydrogen-terminated methyl phenyl polysiloxane which is not involved in the reaction, wherein the POSS-phenyl organosilicon polymer is formed by hydrosilylation to graft hydrogen-terminated methyl phenyl polysiloxane by taking polysiloxane cage octavinyl polysilsesquioxane as a main chain; the component B is methyl phenyl vinyl polysiloxane. By virtue of the phenyl of phenyl vinyl polysiloxane in the component A of the potting adhesive, the high refractive index of the material is ensured; by virtue of an introduced organic polysiloxane system, the heat resistance of the material is improved, the number of cross-linking points is increased and the refractive index of the material is increased; meanwhile, by virtue of phenyl polysiloxane matrix, the high refractive index of the material is ensured; the transparent organic silicon material with high heat resistance and high refractive index can be applied to encapsulation of HB-LED.

Description

technical field

[0001] The invention relates to a silicone potting glue and a preparation method thereof. In particular, a POSS-based silicone potting compound and a preparation method thereof. technical background

[0002] Light-emitting diodes (LEDs) are called "fourth-generation light sources", especially the successful development of high-brightness light-emitting diodes (HB-LEDs), which makes semiconductor lighting partially replace incandescent lamps and fluorescent lamps a reality. In addition to the characteristics of ordinary LEDs, HB-LED has higher brightness, higher power and wider application fields. However, its appearance puts forward higher requirements on the heat resistance and refractive index of the packaging material. At present, LED packaging materials mainly include epoxy resin and silicone materials. Epoxy resin has large internal stress, easy yellowing, poor high and low temperature resistance, and poor aging resistance. Silicone material has low ...