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Polyimide resin composition, film, adhesive agent and component

A technology of polyimide resin and composition, used in adhesives, electrical components, coatings, etc., can solve problems such as peeling, inability to apply high temperature processes, and resin stress, and achieve excellent mechanical properties and heat resistance.

Active Publication Date: 2015-02-04
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, usually, due to the process of forming a coating film of polyamic acid varnish as a precursor of polyimide resin and imidizing it at a high temperature of 300° C. or higher, there is a possibility that the resin shrinks to cause stress, or Problems such as peeling occur
In addition, there is a problem that it cannot be applied to applications that are not suitable for high-temperature processing when using components that are not suitable for high-temperature processing.

Method used

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  • Polyimide resin composition, film, adhesive agent and component
  • Polyimide resin composition, film, adhesive agent and component
  • Polyimide resin composition, film, adhesive agent and component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] (Preparation of polyimide resin composition) 1,3-bis( 3-aminophenoxy)benzene (hereinafter referred to as "APB-N"), and 3,3',4,4'-biphenyltetracarboxylic dianhydride (hereinafter referred to as "s-BPDA") (JFE Chemical Co., Ltd.), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (hereinafter referred to as "BTDA"), APB-N:s-BPDA:BTDA=1.0 :0.69:0.3 molar ratio was compounded. The obtained mixture was stirred for 4 hours or more in a flask into which dry nitrogen gas could be introduced, and a polyamic acid solution having a resin solid content mass of 18 to 25% by mass was obtained. After fully stirring, stir in the flask attached to the Dean-Stark tube, and at the same time heat the reaction system to about 180°C, and take out the water generated by the dehydration reaction to the outside of the system, thus obtaining polyimide resin composition.

[0115] (Preparation of polyimide film) The said polyimide resin composition was apply|coated on the PET film which perfor...

Embodiment 2

[0130] In a solvent adjusted by NMP and mesitylene at a ratio of 8:2, 2,2-bis[4-(4-aminophenoxy)phenyl]propane (hereinafter referred to as "p-BAPP ”) and two kinds of acid dianhydrides, s-BPDA and BTDA, were compounded at a molar ratio of pBAPP:s-BPDA:BTDA=1.0:0.79:0.2. Except for this compounding ratio, other conditions were carried out similarly to Example 1, and the polyimide resin composition was prepared. Furthermore, a polyimide film was produced by the method similar to Example 1, and it evaluated.

Embodiment 3

[0132] APB-N, 4,4'-bis(3-aminophenoxy)biphenyl (hereinafter referred to as "mBP") was mixed in a solvent prepared by adjusting the ratio of NMP and mesitylene to 8:2. These two diamines, s-BPDA, BTDA, and 4,4'-oxydiphthalic anhydride (hereinafter referred to as "ODPA"), three acid dianhydrides are represented by APB-N:mBP:s- The molar ratio of BPDA:BTDA:ODPA=0.5:0.5:0.2:0.3:0.49 was compounded. Except for this compounding ratio, other conditions were carried out similarly to Example 1, and the polyimide resin composition was prepared. Furthermore, a polyimide film was produced by the method similar to Example 1, and it evaluated.

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Abstract

The polyimide resin composition of the present invention at least comprises a polar solvent and a polyimide resin, where the viscosity-average molecular weight of the polyimide resin is 0.6 to 1.60. 95 to 100 mol% of total monomer of the polyimide resin is an aromatic monomer including no aliphatic chain having 3 or more carbon atoms on the main chain, where the aromatic monomer includes a monomer (A) having at least one benzophenone skeleton represented either by chemical formula (1) or (2) in an amount of 5 to 30 mol% in the total monomer, a monomer (B) having a diphenyl ether skeleton, which is free of a biphenyl skeleton, in an amount of 40 to 95 mol% in the total monomer, and a monomer (C) having a biphenyl skeleton in an amount of less than 45 mol% in the total monomer, and 20 to 95 mol% of the monomer (B) in the total monomer constituting the polyimide resin has three or more aromatic rings.

Description

technical field [0001] The present invention relates to a polyimide resin composition comprising at least a polar solvent and a polyimide resin. Moreover, it is related with the film formed from the said polyimide resin composition. Moreover, it is related with the adhesive agent containing the said polyimide resin composition, and the member containing the molded object formed from the said polyimide resin composition. Background technique [0002] In recent years, there has been a strong demand for adhesives excellent in heat resistance in electronic circuit boards, semiconductor devices, and the like, mainly for in-vehicle use. The main adhesive currently used is epoxy resin, but the heat resistance of epoxy resin is not sufficient, and there is a problem that a long time is required for the thermal curing reaction. [0003] On the other hand, thermoplastic polyimide resins have the advantage of having high heat resistance and a relatively short time for thermosetting r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18C08K5/3415C09J179/08
CPCC08K5/3415C08J5/18C08G73/1071C08L79/08C08G73/1042C09D179/04C08G73/1046C09J179/08H05K3/282C08G73/10C08J2379/08C08L2201/08C08L2203/20H05K3/285
Inventor 富田裕介饭田健二今川清水木场繁夫
Owner MITSUI CHEM INC
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