Unlock instant, AI-driven research and patent intelligence for your innovation.

Integrated electric electronic power conversion control device packaging structure

A transformation control and power electronics technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of reducing the thickness of integrated circuit packaging, complex heat dissipation components, and large system volume, so as to eliminate external interference, reduce volume, and simplify effect of connection

Active Publication Date: 2015-03-04
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing electronic device packaging technology is to connect multiple packaged power electronic chips in series and parallel to form a switching element, while the electric vehicle drive motor system and energy storage system each occupy a set of hardware, and there is a whole system Problems such as large volume, high cost, and complex heat dissipation components
The patent document with the publication number 101901799A describes an integrated circuit packaging structure. The packaging structure includes a substrate and a package arranged on the substrate. An adhesive layer is attached to the outside of the package. A metal film is attached to the adhesive layer. In order to reduce the overall packaging thickness of the integrated circuit, the invention is mainly used for electronic products that are increasingly thinner and smaller, and is not suitable for heat dissipation, and is not suitable for packaging some large controller components and energy storage components in an integral module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated electric electronic power conversion control device packaging structure
  • Integrated electric electronic power conversion control device packaging structure
  • Integrated electric electronic power conversion control device packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] This embodiment provides a package structure of an integrated power electronic power conversion control device, the overall package structure diagram is as follows figure 1 As shown, it includes a radiator 1, a substrate 2 arranged on the radiator 1, a conductive layer 3 is arranged on the substrate 2, and a plurality of electronic wafers 4 are arranged on the conductive layer 3, and the electronic wafer 4 It is electrically connected with the substrate 2, the electronic chip 4 and the substrate 2 are coated with a packaging layer 5, and a plurality of external interfaces are reserved, the conductive layer 3 is provided with an insulating groove 31, and the conductive layer 3 is provided with an insulating groove 31. layer 3 as figure 2 In the area enclosed by the thick dotted line, the insulating groove 31 is as figure 2 As shown by the thick solid line in , the conductive layer 3 is divided into several insulating units 32, and the electronic wafer 4 is arranged in...

Embodiment 2

[0043] This embodiment is further limited on the basis of embodiment one, refer to figure 1 , 2 , including a radiator 1, the thickness of the radiator 1 is 5 millimeters, a substrate 2 arranged on the radiator 1, the substrate 2 is an insulating ceramic substrate, and the insulating ceramic substrate is an aluminum nitride ceramic substrate or An alumina ceramic substrate with a thickness of 0.6 mm; a conductive layer 3 is provided on the substrate 2, and the conductive layer 3 is a copper clad layer with a thickness of 0.3 mm.

[0044] In other implementations, the thickness of the radiator can be selected between 4-8 mm according to the application environment; the thickness can be selected between 0.4-0.8 mm according to requirements; the conductive layer 3 is an aluminum-clad layer with a thickness of 0.1-0. Choose between 0.5 mm;

[0045] As a preferred embodiment, such as image 3 As shown, the conductive layer 3 is also provided with a solder layer 33, and the elect...

Embodiment 3

[0048] This embodiment is used as a preferred embodiment, such as Figure 4 On the basis of the second embodiment shown, a control board 6 is further arranged on the conductive layer 3 . The control boards are arranged together on the conductive layer, share the same heat sink, and are packaged together, which further improves the degree of integration, facilitates heat dissipation, and improves the stability of the power electronic power conversion control device.

[0049] The insulation unit 32 is also provided with a temperature measuring resistor. The temperature of the control device can be detected and monitored at any time, which improves the safety of the power electronic power conversion control device.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an integrated electric electronic power conversion control device packaging structure. The structure comprises a radiator and a substrate arranged on the radiator. A conductive layer is arranged on the substrate, a plurality of electronic wafers are arranged on the conductive layer and are electrically connected with the substrate, the electronic wafers and the substrate are covered with packaging layers, and a plurality of external interfaces are reserved, insulation slots are formed in the conductive layer to divide the conductive layer into a plurality of insulation units. The electronic wafers are arranged on the insulation units alternately, so that heating of the electronic wafers is uniform, and heat dissipation is facilitated. By means of the packaging structure, the size of electric electronic power conversion control device is reduced greatly; a power supply and an external circuit are connected through the external interfaces, so that the circuit connection is simplified, the integration level is high, the reliability is good, and the practical value is high.

Description

technical field [0001] The invention relates to a packaging structure of an integrated power electronic power conversion control device, in particular to a packaging structure of an integrated power electronic power conversion control device with high integration and reduced volume. It belongs to the technical field of power electronics. Background technique [0002] In recent years, with the rapid development of integrated circuit technology and materials, chips have become more and more integrated and smaller in size, but their functions have become increasingly powerful. With the rapid development of electronic technology, the miniaturization of packaging and the high density of assembly, as well as the continuous emergence of various new packaging technologies, the requirements for the quality of electronic assembly are also getting higher and higher. [0003] In the past, many electronic packaging materials used ceramics, glass and metal. However, the new sealing mate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/31H01L23/367H01L23/64H01L21/66
CPCH01L2924/13055H01L2924/19107H01L2224/48227H01L2224/48472H01L2224/73265H01L2924/00H01L2224/32225H01L2924/00012
Inventor 徐国卿刘玢玢
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI